IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
04-0508-21

04-0508-21

CONN SOCKET SIP 4POS GOLD

Aries Electronics

0 -
04-0508-21

数据表

508 Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
04-0508-31

04-0508-31

CONN SOCKET SIP 4POS GOLD

Aries Electronics

0 -
04-0508-31

数据表

508 Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
04-1508-21

04-1508-21

CONN IC DIP SOCKET 4POS GOLD

Aries Electronics

0 -
04-1508-21

数据表

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
04-1508-31

04-1508-31

CONN IC DIP SOCKET 4POS GOLD

Aries Electronics

0 -
04-1508-31

数据表

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
116-83-318-41-004101

116-83-318-41-004101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0 -
116-83-318-41-004101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
16-0513-11H

16-0513-11H

CONN SOCKET SIP 16POS GOLD

Aries Electronics

0 -
16-0513-11H

数据表

0513 Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
IC-316-SGG

IC-316-SGG

CONN IC DIP SOCKET 16POS GOLD

Samtec Inc.

0 -
IC-316-SGG

数据表

IC Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Phosphor Bronze Polyester, Glass Filled -55°C ~ 125°C
APH-1004-T-T

APH-1004-T-T

APH-1004-T-T

Samtec Inc.

0 -
APH-1004-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1404-T-T

APH-1404-T-T

APH-1404-T-T

Samtec Inc.

0 -
APH-1404-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1504-T-T

APH-1504-T-T

APH-1504-T-T

Samtec Inc.

0 -
APH-1504-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0604-T-T

APH-0604-T-T

APH-0604-T-T

Samtec Inc.

0 -
APH-0604-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1604-T-T

APH-1604-T-T

APH-1604-T-T

Samtec Inc.

0 -
APH-1604-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0204-T-T

APH-0204-T-T

APH-0204-T-T

Samtec Inc.

0 -
APH-0204-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0804-T-T

APH-0804-T-T

APH-0804-T-T

Samtec Inc.

0 -
APH-0804-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1804-T-T

APH-1804-T-T

APH-1804-T-T

Samtec Inc.

0 -
APH-1804-T-T

数据表

* - Active - - - - - - - - - - - - - - -
116-87-420-41-004101

116-87-420-41-004101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
116-87-420-41-004101

数据表

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICO-316-NTT

ICO-316-NTT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-316-NTT

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
2-1437542-9

2-1437542-9

CONN IC DIP SOCKET 20POS GOLD

TE Connectivity AMP Connectors

0 -
2-1437542-9

数据表

700 - Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Aluminum Alloy -55°C ~ 125°C
121-83-628-41-001101

121-83-628-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
121-83-628-41-001101

数据表

121 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-87-640-31-012101

614-87-640-31-012101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

0 -
614-87-640-31-012101

数据表

614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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