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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
20-3513-11

20-3513-11

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
20-3513-11

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
110-83-950-41-001101

110-83-950-41-001101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

0 -
110-83-950-41-001101

数据表

110 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
117-87-642-41-105101

117-87-642-41-105101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

0 -
117-87-642-41-105101

数据表

117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
21-0518-00

21-0518-00

CONN SOCKET SIP 21POS GOLD

Aries Electronics

0 -
21-0518-00

数据表

518 Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
117-87-428-41-105101

117-87-428-41-105101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
117-87-428-41-105101

数据表

117 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-87-064-01-505101

110-87-064-01-505101

CONN IC DIP SOCKET 64POS GOLD

Preci-Dip

0 -
110-87-064-01-505101

数据表

110 Bulk Active - 64 (2 x 32) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-632-41-003101

116-83-632-41-003101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

0 -
116-83-632-41-003101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
XR2A-1601-N

XR2A-1601-N

IC CONNECTOR

Omron Electronics Inc-EMC Div

0 -
XR2A-1601-N

数据表

* Bulk Active - - - - - - - - - - - - - - -
510-87-100-15-001101

510-87-100-15-001101

CONN SOCKET PGA 100POS GOLD

Preci-Dip

0 -
510-87-100-15-001101

数据表

510 Bulk Active PGA 100 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-100-15-101101

510-87-100-15-101101

CONN SOCKET PGA 100POS GOLD

Preci-Dip

0 -
510-87-100-15-101101

数据表

510 Bulk Active PGA 100 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-648-41-006101

116-87-648-41-006101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

0 -
116-87-648-41-006101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
916715-3

916715-3

CONN SOCKET PGA ZIF 321POS GOLD

TE Connectivity AMP Connectors

0 -
916715-3

数据表

- Tray Obsolete PGA, ZIF (ZIP) 321 (19 x 19) 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Liquid Crystal Polymer (LCP) -
37-0518-10H

37-0518-10H

CONN SOCKET SIP 37POS GOLD

Aries Electronics

0 -
37-0518-10H

数据表

518 Bulk Active SIP 37 (1 x 37) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
HLS-0108-T-32

HLS-0108-T-32

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0108-T-32

数据表

HLS Tube Active SIP 8 (1 x 8) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
16-3518-10H

16-3518-10H

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

0 -
16-3518-10H

数据表

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
27-0518-10H

27-0518-10H

CONN SOCKET SIP 27POS GOLD

Aries Electronics

0 -
27-0518-10H

数据表

518 Bulk Active SIP 27 (1 x 27) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
08-822-90T

08-822-90T

CONN IC DIP SOCKET 8POS TIN

Aries Electronics

0 -
08-822-90T

数据表

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
612-87-650-41-001101

612-87-650-41-001101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

0 -
612-87-650-41-001101

数据表

612 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICA-314-WTT-2

ICA-314-WTT-2

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-314-WTT-2

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
3-1437536-4

3-1437536-4

CONN IC DIP SOCKET 22POS GOLD

TE Connectivity AMP Connectors

0 -
3-1437536-4

数据表

500 Tube Obsolete DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) - - Brass - -55°C ~ 125°C
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