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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
26-1518-00

26-1518-00

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics

0 -
26-1518-00

数据表

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 26 (2 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
08-2820-90C

08-2820-90C

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

0 -
08-2820-90C

数据表

Vertisockets™ 800 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
08-2822-90C

08-2822-90C

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

0 -
08-2822-90C

数据表

Vertisockets™ 800 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
10-2503-20

10-2503-20

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

0 -
10-2503-20

数据表

503 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
10-2503-30

10-2503-30

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

0 -
10-2503-30

数据表

503 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
10-3503-20

10-3503-20

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

0 -
10-3503-20

数据表

503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
10-3503-30

10-3503-30

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

0 -
10-3503-30

数据表

503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
XR2A-2201-N

XR2A-2201-N

CONN IC DIP SOCKET 22POS GOLD

Omron Electronics Inc-EMC Div

0 -
XR2A-2201-N

数据表

XR2 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 29.5µin (0.75µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
510-87-148-15-061101

510-87-148-15-061101

CONN SOCKET PGA 148POS GOLD

Preci-Dip

0 -
510-87-148-15-061101

数据表

510 Bulk Active PGA 148 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-148-15-062101

510-87-148-15-062101

CONN SOCKET PGA 148POS GOLD

Preci-Dip

0 -
510-87-148-15-062101

数据表

510 Bulk Active PGA 148 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICO-632-MTT

ICO-632-MTT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-632-MTT

数据表

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
116-87-636-41-011101

116-87-636-41-011101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

0 -
116-87-636-41-011101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICF-324-F-I

ICF-324-F-I

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-324-F-I

数据表

ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 3.00µin (0.076µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
ICA-624-WTT

ICA-624-WTT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-624-WTT

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
ICF-624-F-O

ICF-624-F-O

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-624-F-O

数据表

ICF Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 3.00µin (0.076µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
110-83-064-01-505101

110-83-064-01-505101

CONN IC DIP SOCKET 64POS GOLD

Preci-Dip

0 -
110-83-064-01-505101

数据表

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-83-952-41-001101

614-83-952-41-001101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

0 -
614-83-952-41-001101

数据表

614 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
38-1518-11

38-1518-11

CONN IC DIP SOCKET 38POS GOLD

Aries Electronics

0 -
38-1518-11

数据表

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 38 (2 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
299-83-320-10-001101

299-83-320-10-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
299-83-320-10-001101

数据表

299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICA-308-WGG

ICA-308-WGG

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-308-WGG

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
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