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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
510-87-145-15-081101

510-87-145-15-081101

CONN SOCKET PGA 145POS GOLD

Preci-Dip

0 -
510-87-145-15-081101

数据表

510 Bulk Active PGA 145 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0503-T-2

HLS-0503-T-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0503-T-2

数据表

HLS Bulk Active SIP 15 (5 x 3) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
299-87-324-10-001101

299-87-324-10-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
299-87-324-10-001101

数据表

299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICO-318-LGT

ICO-318-LGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-318-LGT

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
916657-3

916657-3

CONN SOCKET PGA ZIF 321POS GOLD

TE Connectivity AMP Connectors

0 -
916657-3

数据表

- Tray Obsolete PGA, ZIF (ZIP) 321 (19 x 19) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Phosphor Bronze Liquid Crystal Polymer (LCP) -
146-87-642-41-035101

146-87-642-41-035101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

0 -
146-87-642-41-035101

数据表

146 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0113-G-2

HLS-0113-G-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0113-G-2

数据表

HLS Tube Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
ICF-316-SM-O

ICF-316-SM-O

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-316-SM-O

数据表

ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
ICA-422-ZWTT

ICA-422-ZWTT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-422-ZWTT

数据表

ICA Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
4726

4726

SMT SOCKET - WIDE SOIC-8 (200MIL

Adafruit Industries LLC

0 -
4726

数据表

- Bulk Active SOIC 8 (2 x 4) 0.050" (1.27mm) - - - Surface Mount Closed Frame Solder 0.050" (1.27mm) - - - - -
HLS-0106-G-3

HLS-0106-G-3

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0106-G-3

数据表

HLS Tube Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
12-3503-20

12-3503-20

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

0 -
12-3503-20

数据表

503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
12-3503-30

12-3503-30

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

0 -
12-3503-30

数据表

503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
20-3518-101

20-3518-101

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
20-3518-101

数据表

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
40-6513-10T

40-6513-10T

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
40-6513-10T

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
14-3513-11H

14-3513-11H

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

0 -
14-3513-11H

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
110-83-964-41-005101

110-83-964-41-005101

CONN IC DIP SOCKET 64POS GOLD

Preci-Dip

0 -
110-83-964-41-005101

数据表

110 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICF-640-T-I-TR

ICF-640-T-I-TR

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-640-T-I-TR

数据表

ICF Tape & Reel (TR) Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
116-83-432-41-001101

116-83-432-41-001101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

0 -
116-83-432-41-001101

数据表

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-146-15-061101

510-87-146-15-061101

CONN SOCKET PGA 146POS GOLD

Preci-Dip

0 -
510-87-146-15-061101

数据表

510 Bulk Active PGA 146 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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