IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

全部重置
全部应用
结果
图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
APO-316-T-A1

APO-316-T-A1

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-316-T-A1

数据表

APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
12-0503-20

12-0503-20

CONN SOCKET SIP 12POS GOLD

Aries Electronics

0 -
12-0503-20

数据表

0503 Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
12-0503-30

12-0503-30

CONN SOCKET SIP 12POS GOLD

Aries Electronics

0 -
12-0503-30

数据表

0503 Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
28-0518-00

28-0518-00

CONN SOCKET SIP 28POS GOLD

Aries Electronics

0 -
28-0518-00

数据表

518 Bulk Active SIP 28 (1 x 28) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
28-1518-00

28-1518-00

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

0 -
28-1518-00

数据表

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
24-0518-11H

24-0518-11H

CONN SOCKET SIP 24POS GOLD

Aries Electronics

0 -
24-0518-11H

数据表

518 Bulk Active SIP 24 (1 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
HLS-0112-G-22

HLS-0112-G-22

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0112-G-22

数据表

HLS Tube Active SIP 12 (1 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
22-11

22-11

CONN SOCKET TRANSIST 4POS GOLD

Grayhill Inc.

0 -
22-11

数据表

22 Bulk Obsolete Transistor 4 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Beryllium Copper Thermoplastic, Glass Filled -
117-87-764-41-105101

117-87-764-41-105101

CONN IC DIP SOCKET 64POS GOLD

Preci-Dip

0 -
117-87-764-41-105101

数据表

117 Bulk Active DIP, 0.75" (19.05mm) Row Spacing 64 (2 x 32) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICF-628-TL-O

ICF-628-TL-O

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-628-TL-O

数据表

ICF Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
APH-0502-G-T

APH-0502-G-T

APH-0502-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0602-G-T

APH-0602-G-T

APH-0602-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1102-G-T

APH-1102-G-T

APH-1102-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0202-G-T

APH-0202-G-T

APH-0202-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1202-G-T

APH-1202-G-T

APH-1202-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0702-G-T

APH-0702-G-T

APH-0702-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0302-G-T

APH-0302-G-T

APH-0302-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
110-93-318-41-801000

110-93-318-41-801000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

0 -
110-93-318-41-801000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-43-318-41-801000

110-43-318-41-801000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

0 -
110-43-318-41-801000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
122-87-650-41-001101

122-87-650-41-001101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

0 -
122-87-650-41-001101

数据表

122 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
深圳市宝利科技有限公司

搜索

深圳市宝利科技有限公司

产品

深圳市宝利科技有限公司

电话

深圳市宝利科技有限公司

用户