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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
123-87-650-41-001101

123-87-650-41-001101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

0 -
123-87-650-41-001101

数据表

123 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0310-TT-22

HLS-0310-TT-22

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0310-TT-22

数据表

HLS Tube Active SIP 30 (3 x 10) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
614-83-950-31-012101

614-83-950-31-012101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

0 -
614-83-950-31-012101

数据表

614 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
02-0511-11

02-0511-11

CONN SOCKET SIP 2POS GOLD

Aries Electronics

0 -
02-0511-11

数据表

511 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
06-2503-21

06-2503-21

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

0 -
06-2503-21

数据表

503 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
06-2503-31

06-2503-31

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

0 -
06-2503-31

数据表

503 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
12-6503-20

12-6503-20

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

0 -
12-6503-20

数据表

503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
12-6503-30

12-6503-30

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

0 -
12-6503-30

数据表

503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
16-0517-90C

16-0517-90C

CONN SOCKET SIP 16POS GOLD

Aries Electronics

0 -
16-0517-90C

数据表

0517 Bulk Active SIP 16 (1 x 16) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
146-83-640-41-035101

146-83-640-41-035101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

0 -
146-83-640-41-035101

数据表

146 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
146-83-640-41-036101

146-83-640-41-036101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

0 -
146-83-640-41-036101

数据表

146 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
PGA168H008B5-1706R

PGA168H008B5-1706R

PGA SOCKET 168 CTS

Amphenol ICC (FCI)

0 -
PGA168H008B5-1706R

数据表

- - Active PGA 168 (17 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Through Hole Open Frame - - - - - - -
124-83-432-41-002101

124-83-432-41-002101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

0 -

-

124 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0116-T-10

HLS-0116-T-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0116-T-10

数据表

HLS Tube Active SIP 16 (1 x 16) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
4594

4594

CONN SOCKET TRANSIST TO100 10POS

Keystone Electronics

0 -
4594

数据表

- Bulk Active Transistor, TO-100 10 (Round) - Tin - Brass Chassis Mount Closed Frame Solder - Tin - Brass Polyester, Glass Filled -
116-83-648-41-006101

116-83-648-41-006101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

0 -
116-83-648-41-006101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
13-0511-10

13-0511-10

CONN SOCKET SIP 13POS TIN

Aries Electronics

0 -
13-0511-10

数据表

511 Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
510-87-159-16-071101

510-87-159-16-071101

CONN SOCKET PGA 159POS GOLD

Preci-Dip

0 -
510-87-159-16-071101

数据表

510 Bulk Active PGA 159 (16 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-648-41-007101

116-87-648-41-007101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

0 -
116-87-648-41-007101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0112-G-2

HLS-0112-G-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0112-G-2

数据表

HLS Tube Active SIP 12 (1 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
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