IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
BU480Z-178-HT

BU480Z-178-HT

CONN IC DIP SOCKET 48POS GOLD

On Shore Technology Inc.

0 -
BU480Z-178-HT

数据表

BU-178HT Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 78.7µin (2.00µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Copper Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
110-93-304-41-001000

110-93-304-41-001000

CONN IC DIP SOCKET 4POS GOLD

Mill-Max Manufacturing Corp.

0 -
110-93-304-41-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
ICA-628-ZWTT

ICA-628-ZWTT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-628-ZWTT

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
ICO-632-ZSST

ICO-632-ZSST

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-632-ZSST

数据表

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 125°C
ICA-318-ZWGT

ICA-318-ZWGT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-318-ZWGT

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
ICO-318-CGT

ICO-318-CGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-318-CGT

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
XR2C-3215

XR2C-3215

CONN SOCKET SIP 32POS GOLD

Omron Electronics Inc-EMC Div

0 -
XR2C-3215

数据表

XR2 Bulk Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Threaded - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
116-83-652-41-012101

116-83-652-41-012101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

0 -
116-83-652-41-012101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0120-T-2

HLS-0120-T-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0120-T-2

数据表

HLS Tube Active SIP 20 (1 x 20) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
116-87-648-41-009101

116-87-648-41-009101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

0 -
116-87-648-41-009101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
111-41-304-41-001000

111-41-304-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
111-41-304-41-001000

数据表

111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
111-91-304-41-001000

111-91-304-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
111-91-304-41-001000

数据表

111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
117-93-640-41-005000

117-93-640-41-005000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

0 -
117-93-640-41-005000

数据表

117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
117-43-640-41-005000

117-43-640-41-005000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

0 -
117-43-640-41-005000

数据表

117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
21-0511-10

21-0511-10

CONN SOCKET SIP 21POS TIN

Aries Electronics

0 -
21-0511-10

数据表

511 Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
116-83-636-41-011101

116-83-636-41-011101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

0 -
116-83-636-41-011101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-83-097-14-091101

510-83-097-14-091101

CONN SOCKET PGA 97POS GOLD

Preci-Dip

0 -
510-83-097-14-091101

数据表

510 Bulk Active PGA 97 (14 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
20-3513-11H

20-3513-11H

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
20-3513-11H

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
14-3501-21

14-3501-21

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

0 -
14-3501-21

数据表

501 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
14-3501-31

14-3501-31

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

0 -
14-3501-31

数据表

501 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
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