IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
PGA101H004B1-1321R

PGA101H004B1-1321R

PGA SOCKET 101 CTS

Amphenol ICC (FCI)

0 -

-

- - Active PGA 101 (13 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Open Frame - - - - - - -
HLS-0208-T-12

HLS-0208-T-12

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0208-T-12

数据表

HLS Tube Active SIP 16 (2 x 8) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
ICA-308-JGG

ICA-308-JGG

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-308-JGG

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
ICO-308-JGG

ICO-308-JGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-308-JGG

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
510-83-096-14-091101

510-83-096-14-091101

CONN SOCKET PGA 96POS GOLD

Preci-Dip

0 -
510-83-096-14-091101

数据表

510 Bulk Active PGA 96 (14 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-642-41-009101

116-83-642-41-009101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

0 -
116-83-642-41-009101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
14-3518-01

14-3518-01

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

0 -
14-3518-01

数据表

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
17-0508-20

17-0508-20

CONN SOCKET SIP 17POS GOLD

Aries Electronics

0 -
17-0508-20

数据表

508 Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
17-0508-30

17-0508-30

CONN SOCKET SIP 17POS GOLD

Aries Electronics

0 -
17-0508-30

数据表

508 Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
ICF-322-TL-O-TR

ICF-322-TL-O-TR

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-322-TL-O-TR

数据表

ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
32-6518-10M

32-6518-10M

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

0 -
32-6518-10M

数据表

518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
121-83-650-41-001101

121-83-650-41-001101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

0 -
121-83-650-41-001101

数据表

121 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-182-18-091101

510-87-182-18-091101

CONN SOCKET PGA 182POS GOLD

Preci-Dip

0 -
510-87-182-18-091101

数据表

510 Bulk Active PGA 182 (18 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
APA-324-T-M

APA-324-T-M

ADAPTER PLUG

Samtec Inc.

0 -
APA-324-T-M

数据表

APA Tube Active - 24 (2 x 12) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
510-83-100-13-061101

510-83-100-13-061101

CONN SOCKET PGA 100POS GOLD

Preci-Dip

0 -
510-83-100-13-061101

数据表

510 Bulk Active PGA 100 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-83-100-13-062101

510-83-100-13-062101

CONN SOCKET PGA 100POS GOLD

Preci-Dip

0 -
510-83-100-13-062101

数据表

510 Bulk Active PGA 100 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-83-100-13-063101

510-83-100-13-063101

CONN SOCKET PGA 100POS GOLD

Preci-Dip

0 -
510-83-100-13-063101

数据表

510 Bulk Active PGA 100 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
114-41-304-41-117000

114-41-304-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
114-41-304-41-117000

数据表

114 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
114-91-304-41-117000

114-91-304-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
114-91-304-41-117000

数据表

114 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
HLS-0308-T-22

HLS-0308-T-22

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0308-T-22

数据表

HLS Tube Active SIP 24 (3 x 8) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
深圳市宝利科技有限公司

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