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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
16-6503-30

16-6503-30

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

0 -
16-6503-30

数据表

503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
510-87-192-17-081101

510-87-192-17-081101

CONN SOCKET PGA 192POS GOLD

Preci-Dip

0 -
510-87-192-17-081101

数据表

510 Bulk Active PGA 192 (17 x 17) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-648-41-012101

116-83-648-41-012101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

0 -
116-83-648-41-012101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0304-G-32

HLS-0304-G-32

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0304-G-32

数据表

HLS Tube Active SIP 12 (3 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
HLS-0217-TT-11

HLS-0217-TT-11

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0217-TT-11

数据表

HLS Tube Active SIP 34 (2 x 17) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
HLS-0306-T-10

HLS-0306-T-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0306-T-10

数据表

HLS Tube Active SIP 18 (3 x 6) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
ICO-320-LGT

ICO-320-LGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-320-LGT

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
ICO-314-ZSGG-L

ICO-314-ZSGG-L

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-314-ZSGG-L

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
ICA-314-ZSGG-L

ICA-314-ZSGG-L

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-314-ZSGG-L

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
ICA-316-ZSGG

ICA-316-ZSGG

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-316-ZSGG

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
ICO-316-ZSGG

ICO-316-ZSGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-316-ZSGG

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
214-44-624-01-670799

214-44-624-01-670799

STANDRD SOLDER TAIL DIP SOCKET

Mill-Max Manufacturing Corp.

0 -

-

214 Tape & Reel (TR) Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
214-99-624-01-670799

214-99-624-01-670799

STANDRD SOLDER TAIL DIP SOCKET

Mill-Max Manufacturing Corp.

0 -

-

214 Tape & Reel (TR) Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
16-6511-11WR

16-6511-11WR

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

0 -
16-6511-11WR

数据表

511 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
10-2822-90TWR

10-2822-90TWR

CONN IC DIP SOCKET 10POS TIN

Aries Electronics

0 -
10-2822-90TWR

数据表

Vertisockets™ 800 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
ICF-318-SM-O

ICF-318-SM-O

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-318-SM-O

数据表

ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
116-87-652-41-001101

116-87-652-41-001101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

0 -
116-87-652-41-001101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0305-T-12

HLS-0305-T-12

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0305-T-12

数据表

HLS Tube Active SIP 15 (3 x 5) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
828-AG11D

828-AG11D

CONN IC DIP SOCKET 28POS GOLD

TE Connectivity AMP Connectors

0 -
828-AG11D

数据表

800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 80.0µin (2.03µm) Copper Alloy Polyester -55°C ~ 105°C
28-3518-102

28-3518-102

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

0 -
28-3518-102

数据表

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
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