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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
34-0518-00

34-0518-00

CONN SOCKET SIP 34POS GOLD

Aries Electronics

0 -
34-0518-00

数据表

518 Bulk Active SIP 34 (1 x 34) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
34-1518-00

34-1518-00

CONN IC DIP SOCKET 34POS GOLD

Aries Electronics

0 -
34-1518-00

数据表

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 34 (2 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
18-0508-20

18-0508-20

CONN SOCKET SIP 18POS GOLD

Aries Electronics

0 -
18-0508-20

数据表

508 Bulk Active SIP 18 (1 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
18-0508-30

18-0508-30

CONN SOCKET SIP 18POS GOLD

Aries Electronics

0 -
18-0508-30

数据表

508 Bulk Active SIP 18 (1 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
18-1508-20

18-1508-20

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
18-1508-20

数据表

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
18-1508-30

18-1508-30

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
18-1508-30

数据表

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
18-6820-90T

18-6820-90T

CONN IC DIP SOCKET 18POS TIN

Aries Electronics

0 -
18-6820-90T

数据表

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
212-1-48-006

212-1-48-006

CONN IC DIP SOCKET 48POS GOLD

CNC Tech

0 -
212-1-48-006

数据表

- Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT) -40°C ~ 105°C
ICA-324-SGT-L

ICA-324-SGT-L

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-324-SGT-L

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
116-87-652-41-007101

116-87-652-41-007101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

0 -
116-87-652-41-007101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
115-47-304-41-001000

115-47-304-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

0 -
115-47-304-41-001000

数据表

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
24-0511-10

24-0511-10

CONN SOCKET SIP 24POS TIN

Aries Electronics

0 -
24-0511-10

数据表

511 Bulk Active SIP 24 (1 x 24) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
10-2822-90T

10-2822-90T

CONN IC DIP SOCKET 10POS TIN

Aries Electronics

0 -
10-2822-90T

数据表

Vertisockets™ 800 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
10-2823-90T

10-2823-90T

CONN IC DIP SOCKET 10POS TIN

Aries Electronics

0 -
10-2823-90T

数据表

Vertisockets™ 800 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
ICO-624-LGT

ICO-624-LGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-624-LGT

数据表

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
ICO-324-LGT

ICO-324-LGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-324-LGT

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
HLS-0305-G-11

HLS-0305-G-11

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0305-G-11

数据表

HLS Tube Active SIP 15 (3 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
510-87-177-15-061101

510-87-177-15-061101

CONN SOCKET PGA 177POS GOLD

Preci-Dip

0 -
510-87-177-15-061101

数据表

510 Bulk Active PGA 177 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
APA-308-G-A

APA-308-G-A

ADAPTER PLUG

Samtec Inc.

0 -
APA-308-G-A

数据表

APA Bulk Active - 8 (2 x 4) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
APO-320-T-A1

APO-320-T-A1

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-320-T-A1

数据表

APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
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