IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
APA-320-T-C

APA-320-T-C

ADAPTER PLUG

Samtec Inc.

0 -
APA-320-T-C

数据表

APA Bulk Active - 20 (2 x 10) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
APO-320-T-C

APO-320-T-C

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-320-T-C

数据表

APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
APO-316-T-R

APO-316-T-R

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-316-T-R

数据表

APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
123-13-320-41-001000

123-13-320-41-001000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

0 -
123-13-320-41-001000

数据表

123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
ICF-322-S-O

ICF-322-S-O

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-322-S-O

数据表

ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
35-0518-00

35-0518-00

CONN SOCKET SIP 35POS GOLD

Aries Electronics

0 -
35-0518-00

数据表

518 Bulk Active SIP 35 (1 x 35) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
11-0511-10

11-0511-10

CONN SOCKET SIP 11POS TIN

Aries Electronics

0 -
11-0511-10

数据表

511 Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
16-3518-112

16-3518-112

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

0 -
16-3518-112

数据表

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
24-3518-102

24-3518-102

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
24-3518-102

数据表

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
146-83-650-41-035101

146-83-650-41-035101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

0 -
146-83-650-41-035101

数据表

146 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
146-83-650-41-036101

146-83-650-41-036101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

0 -
146-83-650-41-036101

数据表

146 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0112-G-12

HLS-0112-G-12

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0112-G-12

数据表

HLS Tube Active SIP 12 (1 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
ICO-324-NGT

ICO-324-NGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-324-NGT

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
123-43-320-41-801000

123-43-320-41-801000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

0 -
123-43-320-41-801000

数据表

123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
ICA-320-ZWGT-2

ICA-320-ZWGT-2

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-320-ZWGT-2

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
22-4511-11

22-4511-11

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

0 -
22-4511-11

数据表

511 Bulk Obsolete DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
HLS-0114-G-11

HLS-0114-G-11

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0114-G-11

数据表

HLS Tube Active SIP 14 (1 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
HLS-0120-T-10

HLS-0120-T-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0120-T-10

数据表

HLS Tube Active SIP 20 (1 x 20) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
HLS-0209-T-10

HLS-0209-T-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0209-T-10

数据表

HLS Tube Active SIP 18 (2 x 9) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
ICA-318-WGT-3

ICA-318-WGT-3

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-318-WGT-3

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
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