IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
06-0501-21

06-0501-21

CONN SOCKET SIP 6POS GOLD

Aries Electronics

0 -
06-0501-21

数据表

501 Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
06-0501-31

06-0501-31

CONN SOCKET SIP 6POS GOLD

Aries Electronics

0 -
06-0501-31

数据表

501 Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
15-0503-30

15-0503-30

CONN SOCKET SIP 15POS GOLD

Aries Electronics

0 -
15-0503-30

数据表

0503 Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
26-1518-11H

26-1518-11H

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics

0 -
26-1518-11H

数据表

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 26 (2 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
ICO-318-MGG

ICO-318-MGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-318-MGG

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
116-83-642-41-001101

116-83-642-41-001101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

0 -
116-83-642-41-001101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICA-320-ZWGT-3

ICA-320-ZWGT-3

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-320-ZWGT-3

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
116-83-650-41-007101

116-83-650-41-007101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

0 -
116-83-650-41-007101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
20-4518-11H

20-4518-11H

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
20-4518-11H

数据表

518 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
20-0517-90C

20-0517-90C

CONN SOCKET SIP 20POS GOLD

Aries Electronics

0 -
20-0517-90C

数据表

0517 Bulk Active SIP 20 (1 x 20) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
510-87-181-15-001101

510-87-181-15-001101

CONN SOCKET PGA 181POS GOLD

Preci-Dip

0 -
510-87-181-15-001101

数据表

510 Bulk Active PGA 181 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-181-15-051101

510-87-181-15-051101

CONN SOCKET PGA 181POS GOLD

Preci-Dip

0 -
510-87-181-15-051101

数据表

510 Bulk Active PGA 181 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-43-632-31-012000

614-43-632-31-012000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.

0 -
614-43-632-31-012000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
ICO-314-ZNGG

ICO-314-ZNGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-314-ZNGG

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
APH-0906-T-H

APH-0906-T-H

APH-0906-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0606-T-H

APH-0606-T-H

APH-0606-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1706-T-H

APH-1706-T-H

APH-1706-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0706-T-H

APH-0706-T-H

APH-0706-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0806-T-H

APH-0806-T-H

APH-0806-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
116-83-650-41-012101

116-83-650-41-012101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

0 -
116-83-650-41-012101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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