IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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结果
图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
APH-0610-T-H

APH-0610-T-H

APH-0610-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1110-T-H

APH-1110-T-H

APH-1110-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0210-T-H

APH-0210-T-H

APH-0210-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0310-T-H

APH-0310-T-H

APH-0310-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1610-T-H

APH-1610-T-H

APH-1610-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0910-T-H

APH-0910-T-H

APH-0910-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1210-T-H

APH-1210-T-H

APH-1210-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1410-T-H

APH-1410-T-H

APH-1410-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0710-T-H

APH-0710-T-H

APH-0710-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1710-T-H

APH-1710-T-H

APH-1710-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1310-T-H

APH-1310-T-H

APH-1310-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
3-1437504-6

3-1437504-6

CONN TRANSIST TO-3 3POS GOLD

TE Connectivity AMP Connectors

0 -
3-1437504-6

数据表

8080 Bulk Obsolete Transistor, TO-3 3 (Oval) - Gold 50.0µin (1.27µm) Beryllium Copper Chassis Mount Closed Frame Solder - Gold 50.0µin (1.27µm) Beryllium Copper Polytetrafluoroethylene (PTFE) -55°C ~ 125°C
123-43-632-41-001000

123-43-632-41-001000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.

0 -
123-43-632-41-001000

数据表

123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
35-0511-10

35-0511-10

CONN SOCKET SIP 35POS TIN

Aries Electronics

0 -
35-0511-10

数据表

511 Bulk Active SIP 35 (1 x 35) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
05-7350-10

05-7350-10

CONN SOCKET SIP 5POS TIN

Aries Electronics

0 -
05-7350-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
05-7500-10

05-7500-10

CONN SOCKET SIP 5POS TIN

Aries Electronics

0 -
05-7500-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
05-7560-10

05-7560-10

CONN SOCKET SIP 5POS TIN

Aries Electronics

0 -
05-7560-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
05-7650-10

05-7650-10

CONN SOCKET SIP 5POS TIN

Aries Electronics

0 -
05-7650-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
05-7880-10

05-7880-10

CONN SOCKET SIP 5POS TIN

Aries Electronics

0 -
05-7880-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
33-0518-11H

33-0518-11H

CONN SOCKET SIP 33POS GOLD

Aries Electronics

0 -
33-0518-11H

数据表

518 Bulk Active SIP 33 (1 x 33) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
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