IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
APH-1004-G-R

APH-1004-G-R

APH-1004-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1904-G-R

APH-1904-G-R

APH-1904-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1604-G-R

APH-1604-G-R

APH-1604-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0204-G-R

APH-0204-G-R

APH-0204-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1304-G-R

APH-1304-G-R

APH-1304-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0704-G-R

APH-0704-G-R

APH-0704-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0304-G-R

APH-0304-G-R

APH-0304-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0404-G-R

APH-0404-G-R

APH-0404-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1704-G-R

APH-1704-G-R

APH-1704-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
510-87-201-15-041101

510-87-201-15-041101

CONN SOCKET PGA 201POS GOLD

Preci-Dip

0 -
510-87-201-15-041101

数据表

510 Bulk Active PGA 201 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
36-0511-10

36-0511-10

CONN SOCKET SIP 36POS TIN

Aries Electronics

0 -
36-0511-10

数据表

511 Bulk Active SIP 36 (1 x 36) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
20-9513-10H

20-9513-10H

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
20-9513-10H

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
HLS-0207-G-12

HLS-0207-G-12

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0207-G-12

数据表

HLS Tube Active SIP 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
117-43-648-41-005000

117-43-648-41-005000

CONN IC DIP SOCKET 48POS GOLD

Mill-Max Manufacturing Corp.

0 -
117-43-648-41-005000

数据表

117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
ICA-320-ZSGG-L

ICA-320-ZSGG-L

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-320-ZSGG-L

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
828-AG10D

828-AG10D

CONN IC DIP SOCKET 28POS GOLD

TE Connectivity AMP Connectors

0 -
828-AG10D

数据表

800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) - - - Polyester -55°C ~ 105°C
514-87-068-10-061117

514-87-068-10-061117

CONN SOCKET PGA 68POS GOLD

Preci-Dip

0 -
514-87-068-10-061117

数据表

514 Bulk Active PGA 68 (10 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICA-318-ZAGG

ICA-318-ZAGG

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-318-ZAGG

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
ICO-318-ZAGG

ICO-318-ZAGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-318-ZAGG

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
123-83-652-41-001101

123-83-652-41-001101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

0 -
123-83-652-41-001101

数据表

123 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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