IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
510-87-240-16-001101

510-87-240-16-001101

CONN SOCKET PGA 240POS GOLD

Preci-Dip

0 -
510-87-240-16-001101

数据表

510 Bulk Active PGA 240 (16 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICO-320-AGT

ICO-320-AGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-320-AGT

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
ICA-320-AGT

ICA-320-AGT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-320-AGT

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
110-13-624-41-801000

110-13-624-41-801000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

0 -
110-13-624-41-801000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
16-0508-30

16-0508-30

CONN SOCKET SIP 16POS GOLD

Aries Electronics

0 -
16-0508-30

数据表

508 Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
16-1508-30

16-1508-30

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

0 -
16-1508-30

数据表

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
612-41-304-41-001000

612-41-304-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-41-304-41-001000

数据表

612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
612-91-304-41-001000

612-91-304-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-91-304-41-001000

数据表

612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
3-1674770-2

3-1674770-2

CONN SOCKET PGA ZIF 478POS GOLD

TE Connectivity AMP Connectors

0 -

-

- Tape & Reel (TR) Obsolete PGA, ZIF (ZIP) 478 (26 x 26) 0.050" (1.27mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder 0.050" (1.27mm) Gold 30.0µin (0.76µm) Copper Alloy Thermoplastic -
346-93-128-41-013000

346-93-128-41-013000

CONN SOCKET SIP 28POS GOLD

Mill-Max Manufacturing Corp.

0 -
346-93-128-41-013000

数据表

346 Bulk Active SIP 28 (1 x 28) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
346-43-128-41-013000

346-43-128-41-013000

CONN SOCKET SIP 28POS GOLD

Mill-Max Manufacturing Corp.

0 -
346-43-128-41-013000

数据表

346 Bulk Active SIP 28 (1 x 28) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
832-AG10D

832-AG10D

CONN IC DIP SOCKET 32POS GOLD

TE Connectivity AMP Connectors

0 -
832-AG10D

数据表

800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) - - - Polyester -55°C ~ 105°C
HLS-0306-G-11

HLS-0306-G-11

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0306-G-11

数据表

HLS Tube Active SIP 18 (3 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
HLS-0118-T-32

HLS-0118-T-32

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0118-T-32

数据表

HLS Tube Active SIP 18 (1 x 18) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
32-0518-00

32-0518-00

CONN SOCKET SIP 32POS GOLD

Aries Electronics

0 -
32-0518-00

数据表

518 Bulk Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
10-6810-90T

10-6810-90T

CONN IC DIP SOCKET 10POS TIN

Aries Electronics

0 -
10-6810-90T

数据表

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
ICA-324-KGT

ICA-324-KGT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-324-KGT

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
614-93-304-31-012000

614-93-304-31-012000

SOCKET CARRIER LOWPRO .300 4POS

Mill-Max Manufacturing Corp.

0 -
614-93-304-31-012000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-43-304-31-012000

614-43-304-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-43-304-31-012000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-43-304-31-002000

614-43-304-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-43-304-31-002000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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