IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
540-44-068-17-400004

540-44-068-17-400004

CONN SKT PLCC

Mill-Max Manufacturing Corp.

0 -
540-44-068-17-400004

数据表

540 Tape & Reel (TR) Obsolete PLCC 68 (4 x 17) 0.050" (1.27mm) Tin - Copper Alloy Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin - Copper Alloy Polyphenylene Sulfide (PPS) -55°C ~ 125°C
ICO-624-ZAGT

ICO-624-ZAGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-624-ZAGT

数据表

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
ICA-624-ZAGT

ICA-624-ZAGT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-624-ZAGT

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
ICA-324-WGT

ICA-324-WGT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-324-WGT

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
ICO-324-ZAGT

ICO-324-ZAGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-324-ZAGT

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
ICA-624-WGT

ICA-624-WGT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-624-WGT

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
APO-318-T-B

APO-318-T-B

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-318-T-B

数据表

APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
30-6501-20

30-6501-20

CONN IC DIP SOCKET 30POS TIN

Aries Electronics

0 -
30-6501-20

数据表

501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
30-6501-30

30-6501-30

CONN IC DIP SOCKET 30POS TIN

Aries Electronics

0 -
30-6501-30

数据表

501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
01-0518-00

01-0518-00

CONN SOCKET SIP 1POS GOLD

Aries Electronics

0 -
01-0518-00

数据表

518 Bulk Active SIP 1 (1 x 1) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
36-0518-11H

36-0518-11H

CONN SOCKET SIP 36POS GOLD

Aries Electronics

0 -
36-0518-11H

数据表

518 Bulk Active SIP 36 (1 x 36) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
36-1518-11H

36-1518-11H

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

0 -
36-1518-11H

数据表

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
16-C195-00

16-C195-00

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

0 -
16-C195-00

数据表

EJECT-A-DIP™ Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
16-C280-00

16-C280-00

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

0 -
16-C280-00

数据表

EJECT-A-DIP™ Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
121-11-304-41-001000

121-11-304-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
121-11-304-41-001000

数据表

121 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
714-43-122-31-018000

714-43-122-31-018000

CONN SOCKET SIP 22POS GOLD

Mill-Max Manufacturing Corp.

0 -
714-43-122-31-018000

数据表

714 Bulk Active SIP 22 (1 x 22) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APO-324-T-A

APO-324-T-A

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-324-T-A

数据表

APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
APA-320-G-J

APA-320-G-J

ADAPTER PLUG

Samtec Inc.

0 -
APA-320-G-J

数据表

APA Tube Active - 20 (2 x 10) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
12-7350-10

12-7350-10

CONN SOCKET SIP 12POS TIN

Aries Electronics

0 -
12-7350-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
12-7435-10

12-7435-10

CONN SOCKET SIP 12POS TIN

Aries Electronics

0 -
12-7435-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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