IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
110-43-628-41-001000

110-43-628-41-001000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

1,110 -
110-43-628-41-001000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
25-0513-10

25-0513-10

CONN SOCKET SIP 25POS GOLD

Aries Electronics

304 -
25-0513-10

数据表

0513 Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
40-0518-10

40-0518-10

CONN SOCKET SIP 40POS GOLD

Aries Electronics

2,062 -
40-0518-10

数据表

518 Bulk Active SIP 40 (1 x 40) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
110-43-632-41-001000

110-43-632-41-001000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.

984 -
110-43-632-41-001000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-93-640-41-001000

110-93-640-41-001000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

653 -
110-93-640-41-001000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-13-628-41-001000

110-13-628-41-001000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

1,430 -
110-13-628-41-001000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
40-6518-10

40-6518-10

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

717 -
40-6518-10

数据表

518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
D01-9953242

D01-9953242

CONN SOCKET SIP 32POS GOLD

Harwin Inc.

1,247 -
D01-9953242

数据表

D01-995 Bulk Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
299-43-314-10-001000

299-43-314-10-001000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

367 -
299-43-314-10-001000

数据表

299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
TDU03DTON

TDU03DTON

CONN SOCKET TRANSIST 3POS GOLD

Sullins Connector Solutions

262 -
TDU03DTON

数据表

- Tray Active Transistor 3 (Rectangular) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Board Guide Solder - Gold 30.0µin (0.76µm) Beryllium Copper Polyphenylene Sulfide (PPS) -55°C ~ 175°C
TDU03DTOD

TDU03DTOD

CONN SOCKET TRANSIST 3POS GOLD

Sullins Connector Solutions

213 -
TDU03DTOD

数据表

- Tray Active Transistor 3 (Rectangular) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Board Guide, Flange Solder - Gold 30.0µin (0.76µm) Beryllium Copper Polyphenylene Sulfide (PPS) -55°C ~ 175°C
714-43-164-31-018000

714-43-164-31-018000

CONN SOCKET SIP 64POS GOLD

Mill-Max Manufacturing Corp.

223 -
714-43-164-31-018000

数据表

714 Tube Active SIP 64 (1 x 64) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
28-6554-11

28-6554-11

CONN IC DIP SOCKET ZIF 28POS GLD

Aries Electronics

145 -
28-6554-11

数据表

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
214-3339-00-0602J

214-3339-00-0602J

CONN IC DIP SOCKET ZIF 14POS GLD

3M

312 -
214-3339-00-0602J

数据表

Textool™ Tube Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
224-1275-00-0602J

224-1275-00-0602J

CONN IC DIP SOCKET ZIF 24POS GLD

3M

199 -
224-1275-00-0602J

数据表

Textool™ Tube Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
216-3340-00-0602J

216-3340-00-0602J

CONN IC DIP SOCKET ZIF 16POS GLD

3M

565 -
216-3340-00-0602J

数据表

Textool™ Tube Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
208-7391-55-1902

208-7391-55-1902

CONN SOCKET SOIC 8POS GOLD

3M

298 -
208-7391-55-1902

数据表

Textool™ Bulk Active SOIC 8 (2 x 4) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder - Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES), Glass Filled -55°C ~ 150°C
248-1282-00-0602J

248-1282-00-0602J

CONN IC DIP SOCKET ZIF 48POS GLD

3M

614 -
248-1282-00-0602J

数据表

Textool™ Tube Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
216-7224-55-1902

216-7224-55-1902

CONN SOCKET SOIC 16POS GOLD

3M

228 -
216-7224-55-1902

数据表

Textool™ Bulk Active SOIC 16 (2 x 8) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES), Glass Filled -55°C ~ 150°C
203-2737-55-1102

203-2737-55-1102

CONN TRANSIST TO-3/TO-66 3POS

3M

72 -
203-2737-55-1102

数据表

Textool™ Bulk Active Transistor, TO-3 and TO-66 3 (Rectangular) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.234" (5.94mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -55°C ~ 150°C
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