IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
264-4493-00-0602J

264-4493-00-0602J

CONN IC DIP SOCKET ZIF 64POS GLD

3M

37 -
264-4493-00-0602J

数据表

Textool™ Tube Active DIP, ZIF (ZIP), 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
225-PRS15001-12

225-PRS15001-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

30 -
225-PRS15001-12

数据表

PRS Bulk Active PGA, ZIF (ZIP) 225 (15 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
289-PRS17001-12

289-PRS17001-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

34 -
289-PRS17001-12

数据表

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
240-5205-01

240-5205-01

CONN SOCKET QFN 40POS GOLD

3M

27 -
240-5205-01

数据表

Textool™ Bulk Active QFN 40 (4 x 10) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Beryllium Copper Polyethersulfone (PES) -
ICS-306-T

ICS-306-T

IC SOCKET, DIP, 6P 2.54MM PITCH

Adam Tech

7,748 -
ICS-306-T

数据表

ICS Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
ICS-308-T

ICS-308-T

IC SOCKET, DIP, 8P 2.54MM PITCH

Adam Tech

10,424 -
ICS-308-T

数据表

ICS Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
ICS-314-T

ICS-314-T

IC SOCKET, DIP, 14P 2.54MM PITCH

Adam Tech

2,629 -
ICS-314-T

数据表

ICS Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
ICS-316-T

ICS-316-T

IC SOCKET, DIP, 16P 2.54MM PITCH

Adam Tech

21,453 -
ICS-316-T

数据表

ICS Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
ICS-318-T

ICS-318-T

IC SOCKET, DIP, 18P 2.54MM PITCH

Adam Tech

9,810 -
ICS-318-T

数据表

ICS Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
ED14DT

ED14DT

CONN IC DIP SOCKET 14POS TIN

On Shore Technology Inc.

10,684 -
ED14DT

数据表

ED Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 110°C
ICS-320-T

ICS-320-T

IC SOCKET, DIP, 20P 2.54MM PITCH

Adam Tech

9,010 -
ICS-320-T

数据表

ICS Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
A 08-LC-TR

A 08-LC-TR

CONN IC DIP SOCKET 8POS TIN

Assmann WSW Components

4,012 -
A 08-LC-TR

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 85°C
AR 06-HZL-TT

AR 06-HZL-TT

CONN IC DIP SOCKET 6POS TIN

Assmann WSW Components

5,612 -
AR 06-HZL-TT

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
245-08-1-03

245-08-1-03

CONN IC DIP SOCKET 8POS TIN

CNC Tech

3,915 -
245-08-1-03

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole, Kinked Pin Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
ICS-324-T

ICS-324-T

IC SOCKET, DIP, 24P 2.54MM PITCH

Adam Tech

1,884 -
ICS-324-T

数据表

ICS Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
1-2199298-1

1-2199298-1

CONN IC DIP SOCKET 6POS TIN

TE Connectivity AMP Connectors

6,487 -
1-2199298-1

数据表

Diplomate DL Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass, Copper Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
1-2199298-3

1-2199298-3

CONN IC DIP SOCKET 14POS TIN

TE Connectivity AMP Connectors

8,658 -
1-2199298-3

数据表

Diplomate DL Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass, Copper Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
DILB8P-223TLF

DILB8P-223TLF

CONN IC DIP SOCKET 8POS TIN

Amphenol ICC (FCI)

3,490 -
DILB8P-223TLF

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin 100.0µin (2.54µm) Copper Alloy Polyamide (PA), Nylon -55°C ~ 105°C
ED40DT

ED40DT

CONN IC DIP SOCKET 40POS TIN

On Shore Technology Inc.

0 -
ED40DT

数据表

ED Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 110°C
ICS-328-T

ICS-328-T

IC SOCKET, DIP, 28P 2.54MM PITCH

Adam Tech

3,016 -
ICS-328-T

数据表

ICS Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
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