IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
APH-0906-G-T

APH-0906-G-T

APH-0906-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1906-G-T

APH-1906-G-T

APH-1906-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1106-G-T

APH-1106-G-T

APH-1106-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0206-G-T

APH-0206-G-T

APH-0206-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1206-G-T

APH-1206-G-T

APH-1206-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0806-G-T

APH-0806-G-T

APH-0806-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1706-G-T

APH-1706-G-T

APH-1706-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
ICA-648-SGT

ICA-648-SGT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-648-SGT

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
ICA-648-WTT

ICA-648-WTT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-648-WTT

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
ICO-648-SGT

ICO-648-SGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-648-SGT

数据表

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
510-83-182-18-091101

510-83-182-18-091101

CONN SOCKET PGA 182POS GOLD

Preci-Dip

0 -
510-83-182-18-091101

数据表

510 Bulk Active PGA 182 (18 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
12-6810-90WR

12-6810-90WR

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

0 -
12-6810-90WR

数据表

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
ICO-322-CGG

ICO-322-CGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-322-CGG

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
24-6518-10E

24-6518-10E

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
24-6518-10E

数据表

518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
ICF-648-FM-I

ICF-648-FM-I

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-648-FM-I

数据表

ICF Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 3.00µin (0.076µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
510-83-177-15-061101

510-83-177-15-061101

CONN SOCKET PGA 177POS GOLD

Preci-Dip

0 -
510-83-177-15-061101

数据表

510 Bulk Active PGA 177 (15 x 15) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICA-320-ZHGT

ICA-320-ZHGT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-320-ZHGT

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
HLS-0118-G-10

HLS-0118-G-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0118-G-10

数据表

HLS Tube Active SIP 18 (1 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
10-6503-21

10-6503-21

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

0 -
10-6503-21

数据表

503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
10-6503-31

10-6503-31

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

0 -
10-6503-31

数据表

503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
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