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0755-82798135IC 插座
| 图片 | 厂商型号 | 可用性 | 价格 | 数量 | 数据表 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量(网格) | 配对间距 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 端接方式 | 引脚间距 | 触点表面处理 - 引脚 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 | 外壳材料 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
APH-0212-T-HAPH-0212-T-H |
0 | - |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
APH-0312-T-HAPH-0312-T-H |
0 | - |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
APH-1312-T-HAPH-1312-T-H |
0 | - |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
APH-1212-T-HAPH-1212-T-H |
0 | - |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
ICA-422-ZHGT.100" SCREW MACHINE DIP SOCKET |
0 | - |
|
数据表 |
ICA | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 10.0µin (0.25µm) | Brass | Polyester, Glass Filled | -55°C ~ 125°C |
|
18-81000-310CCONN IC DIP SOCKET 18POS GOLD |
0 | - |
|
数据表 |
8 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
18-81250-310CCONN IC DIP SOCKET 18POS GOLD |
0 | - |
|
数据表 |
8 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
18-8250-310CCONN IC DIP SOCKET 18POS GOLD |
0 | - |
|
数据表 |
8 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
18-8300-310CCONN IC DIP SOCKET 18POS GOLD |
0 | - |
|
数据表 |
8 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
18-8375-310CCONN IC DIP SOCKET 18POS GOLD |
0 | - |
|
数据表 |
8 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
18-8400-310CCONN IC DIP SOCKET 18POS GOLD |
0 | - |
|
数据表 |
8 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
18-8406-310CCONN IC DIP SOCKET 18POS GOLD |
0 | - |
|
数据表 |
8 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
18-8500-310CCONN IC DIP SOCKET 18POS GOLD |
0 | - |
|
数据表 |
8 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
18-8545-310CCONN IC DIP SOCKET 18POS GOLD |
0 | - |
|
数据表 |
8 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
18-8600-310CCONN IC DIP SOCKET 18POS GOLD |
0 | - |
|
数据表 |
8 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
18-8670-310CCONN IC DIP SOCKET 18POS GOLD |
0 | - |
|
数据表 |
8 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
|
18-8750-310CCONN IC DIP SOCKET 18POS GOLD |
0 | - |
|
数据表 |
8 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
APA-316-G-MADAPTER PLUG |
0 | - |
|
数据表 |
APA | Tube | Active | - | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | - |
|
14-0501-20CONN SOCKET SIP 14POS TIN |
0 | - |
|
数据表 |
501 | Bulk | Active | SIP | 14 (1 x 14) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | - | Wire Wrap | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
14-0501-30CONN SOCKET SIP 14POS TIN |
0 | - |
|
数据表 |
501 | Bulk | Active | SIP | 14 (1 x 14) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | - | Wire Wrap | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |

