IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
16-1508-21

16-1508-21

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

0 -
16-1508-21

数据表

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
16-1508-31

16-1508-31

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

0 -
16-1508-31

数据表

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
38-6501-20

38-6501-20

CONN IC DIP SOCKET 38POS TIN

Aries Electronics

0 -
38-6501-20

数据表

501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 38 (2 x 19) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
HLS-0312-T-10

HLS-0312-T-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0312-T-10

数据表

HLS Tube Active SIP 36 (3 x 12) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
346-93-141-41-013000

346-93-141-41-013000

CONN SOCKET SIP 41POS GOLD

Mill-Max Manufacturing Corp.

0 -
346-93-141-41-013000

数据表

346 Bulk Active SIP 41 (1 x 41) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
346-43-141-41-013000

346-43-141-41-013000

CONN SOCKET SIP 41POS GOLD

Mill-Max Manufacturing Corp.

0 -
346-43-141-41-013000

数据表

346 Bulk Active SIP 41 (1 x 41) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
ICA-318-JGG

ICA-318-JGG

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-318-JGG

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
31-0508-20

31-0508-20

CONN SOCKET SIP 31POS GOLD

Aries Electronics

0 -
31-0508-20

数据表

508 Bulk Active SIP 31 (1 x 31) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
31-0508-30

31-0508-30

CONN SOCKET SIP 31POS GOLD

Aries Electronics

0 -
31-0508-30

数据表

508 Bulk Active SIP 31 (1 x 31) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
24-0508-20

24-0508-20

CONN SOCKET SIP 24POS GOLD

Aries Electronics

0 -
24-0508-20

数据表

508 Bulk Active SIP 24 (1 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
24-0508-30

24-0508-30

CONN SOCKET SIP 24POS GOLD

Aries Electronics

0 -
24-0508-30

数据表

508 Bulk Active SIP 24 (1 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
24-1508-20

24-1508-20

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
24-1508-20

数据表

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
24-1508-30

24-1508-30

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
24-1508-30

数据表

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
714-43-132-31-018000

714-43-132-31-018000

CONN SOCKET SIP 32POS GOLD

Mill-Max Manufacturing Corp.

0 -
714-43-132-31-018000

数据表

714 Tube Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
210-93-306-41-001000

210-93-306-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
210-93-306-41-001000

数据表

210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
714-43-218-31-018000

714-43-218-31-018000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

0 -
714-43-218-31-018000

数据表

714 Bulk Active DIP, 0.1" (2.54mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APH-1820-T-R

APH-1820-T-R

APH-1820-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0920-T-R

APH-0920-T-R

APH-0920-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1420-T-R

APH-1420-T-R

APH-1420-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0520-T-R

APH-0520-T-R

APH-0520-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
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