IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
24-6556-10

24-6556-10

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
24-6556-10

数据表

6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
18-820-90C

18-820-90C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
18-820-90C

数据表

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
18-823-90C

18-823-90C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
18-823-90C

数据表

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
HLS-0317-TT-11

HLS-0317-TT-11

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0317-TT-11

数据表

HLS Tube Active SIP 51 (3 x 17) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
115-41-310-41-001000

115-41-310-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-41-310-41-001000

数据表

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
115-91-310-41-001000

115-91-310-41-001000

SKT IC OPEN LOWPRO

Mill-Max Manufacturing Corp.

0 -
115-91-310-41-001000

数据表

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APH-0912-T-R

APH-0912-T-R

APH-0912-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1412-T-R

APH-1412-T-R

APH-1412-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1512-T-R

APH-1512-T-R

APH-1512-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0512-T-R

APH-0512-T-R

APH-0512-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0612-T-R

APH-0612-T-R

APH-0612-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1612-T-R

APH-1612-T-R

APH-1612-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1312-T-R

APH-1312-T-R

APH-1312-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0712-T-R

APH-0712-T-R

APH-0712-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
115-43-306-41-001000

115-43-306-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-43-306-41-001000

数据表

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
ICO-624-AGT

ICO-624-AGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-624-AGT

数据表

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
ICO-632-ZNGT

ICO-632-ZNGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-632-ZNGT

数据表

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
210-41-308-41-001000

210-41-308-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
210-41-308-41-001000

数据表

210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
210-91-308-41-001000

210-91-308-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
210-91-308-41-001000

数据表

210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-47-210-41-001000

110-47-210-41-001000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

0 -
110-47-210-41-001000

数据表

110 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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