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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
18-8685-610C

18-8685-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
18-8685-610C

数据表

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
18-8700-610C

18-8700-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
18-8700-610C

数据表

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
18-8750-610C

18-8750-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
18-8750-610C

数据表

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
18-8870-610C

18-8870-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
18-8870-610C

数据表

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
HLS-0610-TT-22

HLS-0610-TT-22

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0610-TT-22

数据表

HLS Bulk Active SIP 60 (6 x 10) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
20-0501-21

20-0501-21

CONN SOCKET SIP 20POS GOLD

Aries Electronics

0 -
20-0501-21

数据表

501 Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
20-0501-31

20-0501-31

CONN SOCKET SIP 20POS GOLD

Aries Electronics

0 -
20-0501-31

数据表

501 Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
614-87-084-10-001112

614-87-084-10-001112

CONN SOCKET PGA 84POS GOLD

Preci-Dip

0 -
614-87-084-10-001112

数据表

614 Bulk Active PGA 84 (10 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-87-084-10-031112

614-87-084-10-031112

CONN SOCKET PGA 84POS GOLD

Preci-Dip

0 -
614-87-084-10-031112

数据表

614 Bulk Active PGA 84 (10 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
40-6513-11H

40-6513-11H

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
40-6513-11H

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
APO-628-T-R

APO-628-T-R

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-628-T-R

数据表

APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
APH-0916-T-H

APH-0916-T-H

APH-0916-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0516-T-H

APH-0516-T-H

APH-0516-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1516-T-H

APH-1516-T-H

APH-1516-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0616-T-H

APH-0616-T-H

APH-0616-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1116-T-H

APH-1116-T-H

APH-1116-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1316-T-H

APH-1316-T-H

APH-1316-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0816-T-H

APH-0816-T-H

APH-0816-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
110-99-210-41-001000

110-99-210-41-001000

CONN IC DIP SOCKET 10POS TINLEAD

Mill-Max Manufacturing Corp.

0 -
110-99-210-41-001000

数据表

110 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-44-210-41-001000

110-44-210-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-44-210-41-001000

数据表

110 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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