IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
612-43-310-41-001000

612-43-310-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-43-310-41-001000

数据表

612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APH-0426-T-H

APH-0426-T-H

APH-0426-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1926-T-H

APH-1926-T-H

APH-1926-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1426-T-H

APH-1426-T-H

APH-1426-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0926-T-H

APH-0926-T-H

APH-0926-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1026-T-H

APH-1026-T-H

APH-1026-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0626-T-H

APH-0626-T-H

APH-0626-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0726-T-H

APH-0726-T-H

APH-0726-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1326-T-H

APH-1326-T-H

APH-1326-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0226-T-H

APH-0226-T-H

APH-0226-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1826-T-H

APH-1826-T-H

APH-1826-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
317-47-119-41-005000

317-47-119-41-005000

STANDRD SOLDRTL SNG SKT

Mill-Max Manufacturing Corp.

0 -
317-47-119-41-005000

数据表

317 Bulk Active SIP 19 (1 x 19) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APA-318-G-N

APA-318-G-N

ADAPTER PLUG

Samtec Inc.

0 -
APA-318-G-N

数据表

APA Tube Active - 18 (2 x 9) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
115-93-322-41-001000

115-93-322-41-001000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.

0 -
115-93-322-41-001000

数据表

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
115-93-422-41-001000

115-93-422-41-001000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.

0 -
115-93-422-41-001000

数据表

115 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
115-43-322-41-001000

115-43-322-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-43-322-41-001000

数据表

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
115-43-422-41-001000

115-43-422-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-43-422-41-001000

数据表

115 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
111-41-328-41-001000

111-41-328-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
111-41-328-41-001000

数据表

111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
111-41-628-41-001000

111-41-628-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
111-41-628-41-001000

数据表

111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
111-91-328-41-001000

111-91-328-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
111-91-328-41-001000

数据表

111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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