IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
APO-324-G-A

APO-324-G-A

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-324-G-A

数据表

APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
APH-0508-G-R

APH-0508-G-R

APH-0508-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1308-G-R

APH-1308-G-R

APH-1308-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1208-G-R

APH-1208-G-R

APH-1208-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0908-G-R

APH-0908-G-R

APH-0908-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1408-G-R

APH-1408-G-R

APH-1408-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1708-G-R

APH-1708-G-R

APH-1708-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0708-G-R

APH-0708-G-R

APH-0708-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
510-83-241-19-101101

510-83-241-19-101101

CONN SOCKET PGA 241POS GOLD

Preci-Dip

0 -
510-83-241-19-101101

数据表

510 Bulk Active PGA 241 (19 x 19) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
20-1508-21

20-1508-21

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
20-1508-21

数据表

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
20-1508-31

20-1508-31

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
20-1508-31

数据表

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
116-47-316-41-007000

116-47-316-41-007000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

0 -
116-47-316-41-007000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
317-93-114-41-005000

317-93-114-41-005000

CONN SKT SNG

Mill-Max Manufacturing Corp.

0 -
317-93-114-41-005000

数据表

317 Bulk Active SIP 14 (1 x 14) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-41-318-41-003000

116-41-318-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-41-318-41-003000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-91-318-41-003000

116-91-318-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-91-318-41-003000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APA-320-G-M

APA-320-G-M

ADAPTER PLUG

Samtec Inc.

0 -
APA-320-G-M

数据表

APA Tube Active - 20 (2 x 10) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
410-91-224-10-001000

410-91-224-10-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

0 -
410-91-224-10-001000

数据表

410 Tube Active Zig-Zag, Left Stackable 24 (2 x 12) 0.100" (2.54mm) - - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
410-91-224-10-002000

410-91-224-10-002000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

0 -
410-91-224-10-002000

数据表

410 Tube Active Zig-Zag, Right Stackable 24 (2 x 12) 0.100" (2.54mm) - - Beryllium Copper Through Hole - Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-41-320-41-003000

116-41-320-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-41-320-41-003000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-41-420-41-003000

116-41-420-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-41-420-41-003000

数据表

116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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