IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
612-41-318-41-004000

612-41-318-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-41-318-41-004000

数据表

612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
612-91-318-41-004000

612-91-318-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-91-318-41-004000

数据表

612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APH-1814-G-T

APH-1814-G-T

APH-1814-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0914-G-T

APH-0914-G-T

APH-0914-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1414-G-T

APH-1414-G-T

APH-1414-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0514-G-T

APH-0514-G-T

APH-0514-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1914-G-T

APH-1914-G-T

APH-1914-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1514-G-T

APH-1514-G-T

APH-1514-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1014-G-T

APH-1014-G-T

APH-1014-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1114-G-T

APH-1114-G-T

APH-1114-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0214-G-T

APH-0214-G-T

APH-0214-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1214-G-T

APH-1214-G-T

APH-1214-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1714-G-T

APH-1714-G-T

APH-1714-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1314-G-T

APH-1314-G-T

APH-1314-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0814-G-T

APH-0814-G-T

APH-0814-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0314-G-T

APH-0314-G-T

APH-0314-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0714-G-T

APH-0714-G-T

APH-0714-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
110-43-328-10-002000

110-43-328-10-002000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

0 -
110-43-328-10-002000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14), 14 Loaded 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
126-41-316-41-003000

126-41-316-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-41-316-41-003000

数据表

126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
126-91-316-41-003000

126-91-316-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-91-316-41-003000

数据表

126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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