IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
116-41-636-41-006000

116-41-636-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-41-636-41-006000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-91-636-41-006000

116-91-636-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-91-636-41-006000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
546-87-145-15-081136

546-87-145-15-081136

CONN SOCKET PGA 145POS GOLD

Preci-Dip

0 -
546-87-145-15-081136

数据表

546 Bulk Active PGA 145 (15 x 15) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
146-93-628-41-012000

146-93-628-41-012000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

0 -
146-93-628-41-012000

数据表

146 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
146-43-628-41-012000

146-43-628-41-012000

CONN SKT DBL

Mill-Max Manufacturing Corp.

0 -
146-43-628-41-012000

数据表

146 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APO-422-G-A

APO-422-G-A

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-422-G-A

数据表

APO Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
32-8800-610C

32-8800-610C

CONN ELEVATOR SOCKET 32 PIN .600

Aries Electronics

0 -

-

8 - Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
34-6501-21

34-6501-21

CONN IC DIP SOCKET 34POS GOLD

Aries Electronics

0 -
34-6501-21

数据表

501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 34 (2 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
34-6501-31

34-6501-31

CONN IC DIP SOCKET 34POS GOLD

Aries Electronics

0 -
34-6501-31

数据表

501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 34 (2 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
17-0511-11

17-0511-11

CONN SOCKET SIP 17POS GOLD

Aries Electronics

0 -
17-0511-11

数据表

511 Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
40-0501-20

40-0501-20

CONN SOCKET SIP 40POS TIN

Aries Electronics

0 -
40-0501-20

数据表

501 Bulk Active SIP 40 (1 x 40) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
40-0501-30

40-0501-30

CONN SOCKET SIP 40POS TIN

Aries Electronics

0 -
40-0501-30

数据表

501 Bulk Active SIP 40 (1 x 40) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
APH-1910-G-H

APH-1910-G-H

APH-1910-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0610-G-H

APH-0610-G-H

APH-0610-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0210-G-H

APH-0210-G-H

APH-0210-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0310-G-H

APH-0310-G-H

APH-0310-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0710-G-H

APH-0710-G-H

APH-0710-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1610-G-H

APH-1610-G-H

APH-1610-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
126-93-316-41-002000

126-93-316-41-002000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.

0 -
126-93-316-41-002000

数据表

126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
126-43-316-41-002000

126-43-316-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-43-316-41-002000

数据表

126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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