IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
24-1508-31

24-1508-31

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
24-1508-31

数据表

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
714-43-228-31-018000

714-43-228-31-018000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

0 -
714-43-228-31-018000

数据表

714 Bulk Active DIP, 0.1" (2.54mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
HLS-0508-T-11

HLS-0508-T-11

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0508-T-11

数据表

HLS Bulk Active SIP 40 (5 x 8) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
ICA-628-ZHGT

ICA-628-ZHGT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-628-ZHGT

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
126-93-320-41-002000

126-93-320-41-002000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

0 -
126-93-320-41-002000

数据表

126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
126-93-420-41-002000

126-93-420-41-002000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

0 -
126-93-420-41-002000

数据表

126 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
126-43-320-41-002000

126-43-320-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-43-320-41-002000

数据表

126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
126-43-420-41-002000

126-43-420-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-43-420-41-002000

数据表

126 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APH-1924-T-R

APH-1924-T-R

APH-1924-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1024-T-R

APH-1024-T-R

APH-1024-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1124-T-R

APH-1124-T-R

APH-1124-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1724-T-R

APH-1724-T-R

APH-1724-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1224-T-R

APH-1224-T-R

APH-1224-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0224-T-R

APH-0224-T-R

APH-0224-T-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
614-87-124-13-041112

614-87-124-13-041112

CONN SOCKET PGA 124POS GOLD

Preci-Dip

0 -
614-87-124-13-041112

数据表

614 Bulk Active PGA 124 (13 x 13) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
21-0503-21

21-0503-21

CONN SOCKET SIP 21POS GOLD

Aries Electronics

0 -
21-0503-21

数据表

0503 Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
21-0503-31

21-0503-31

CONN SOCKET SIP 21POS GOLD

Aries Electronics

0 -
21-0503-31

数据表

0503 Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
126-41-318-41-003000

126-41-318-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-41-318-41-003000

数据表

126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
126-91-318-41-003000

126-91-318-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-91-318-41-003000

数据表

126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
517-87-321-17-101111

517-87-321-17-101111

CONN SOCKET PGA 321POS GOLD

Preci-Dip

0 -
517-87-321-17-101111

数据表

517 Bulk Active PGA 321 (17 x 17) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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