IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

全部重置
全部应用
结果
图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
APH-0226-T-T

APH-0226-T-T

APH-0226-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1326-T-T

APH-1326-T-T

APH-1326-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0326-T-T

APH-0326-T-T

APH-0326-T-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
100-PGM13061-10

100-PGM13061-10

CONN SOCKET PGA GOLD

Aries Electronics

0 -
100-PGM13061-10

数据表

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
104-13-324-41-770000

104-13-324-41-770000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

0 -
104-13-324-41-770000

数据表

104 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic -
104-13-424-41-770000

104-13-424-41-770000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

0 -
104-13-424-41-770000

数据表

104 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic -
104-13-624-41-770000

104-13-624-41-770000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

0 -
104-13-624-41-770000

数据表

104 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic -
517-87-320-19-131111

517-87-320-19-131111

CONN SOCKET PGA 320POS GOLD

Preci-Dip

0 -
517-87-320-19-131111

数据表

517 Bulk Active PGA 320 (19 x 19) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0218-T-12

HLS-0218-T-12

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0218-T-12

数据表

HLS Tube Active SIP 36 (2 x 18) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
20-9503-21

20-9503-21

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
20-9503-21

数据表

503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
20-9503-31

20-9503-31

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
20-9503-31

数据表

503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
APA-422-G-C

APA-422-G-C

ADAPTER PLUG

Samtec Inc.

0 -
APA-422-G-C

数据表

APA Bulk Active - 22 (2 x 11) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
APO-322-G-C

APO-322-G-C

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-322-G-C

数据表

APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
APA-632-G-A1

APA-632-G-A1

ADAPTER PLUG

Samtec Inc.

0 -
APA-632-G-A1

数据表

APA Bulk Active - 32 (2 x 16) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
210-11-636-41-001000

210-11-636-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
210-11-636-41-001000

数据表

210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-41-642-41-006000

116-41-642-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-41-642-41-006000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-91-642-41-006000

116-91-642-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-91-642-41-006000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
114-41-652-41-117000

114-41-652-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
114-41-652-41-117000

数据表

114 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
114-91-652-41-117000

114-91-652-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
114-91-652-41-117000

数据表

114 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
114-93-636-41-117000

114-93-636-41-117000

CONN IC DIP SOCKET 36POS GOLD

Mill-Max Manufacturing Corp.

0 -
114-93-636-41-117000

数据表

114 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
深圳市宝利科技有限公司

搜索

深圳市宝利科技有限公司

产品

深圳市宝利科技有限公司

电话

深圳市宝利科技有限公司

用户