IC 插座
| 图片 | 厂商型号 | 可用性 | 价格 | 数量 | 数据表 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量（网格） | 配对间距 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 端接方式 | 引脚间距 | 触点表面处理 - 引脚 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 | 外壳材料 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
212124WECONN IC DIP SOCKET 24POS |
486 | - |
|
数据表
|
- | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | - | - | - | Through Hole | Open Frame | - | 0.100" (2.54mm) | - | - | - | - | -40°C ~ 105°C |
|
|
212128WECONN IC DIP SOCKET 28POS |
358 | - |
|
数据表
|
- | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | - | - | - | Through Hole | Open Frame | - | 0.100" (2.54mm) | - | - | - | - | -40°C ~ 105°C |
|
|
CAP-002-04-000402 Capcitor Test Socket |
20 | - |
|
数据表
|
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
108493-0009DDR Socket, 78 BGA 7.5 mm x 10.6 |
25 | - |
|
数据表
|
Grypper | Bag | Active | BGA | 78 (6 x 13) | 0.031" (0.80mm) | - | - | - | - | - | Solder | - | - | - | - | - | - |
|
|
104670-0040Socket-NAND 12.0 x 18.0 -1.0 SAC |
25 | - |
|
数据表
|
Grypper | Bag | Active | PGA | 132 | - | - | - | - | Surface Mount | - | Solder | - | - | - | - | - | - |
|
|
104670-0043Socket-NAND 12.0 x 18.0 -1.0 pi |
25 | - |
|
数据表
|
Grypper | Bag | Active | PGA | 132 | - | - | - | - | Surface Mount | - | Solder | - | - | - | - | - | - |
|
|
108387-0026Socket-eMMC/UFS,153 BGA 11.5 mm |
25 | - |
|
数据表
|
- | Bag | Active | BGA | 153 (12 x 13) | 0.020" (0.50mm) | - | - | - | Through Hole | - | Solder | 0.020" (0.50mm) | - | - | - | - | - |
|
|
107250-0059Socket-eMMC/UFS, 153 BGA 10.0 mm |
25 | - |
|
数据表
|
- | Bag | Active | BGA | 153 (12 x 13) | 0.020" (0.50mm) | - | - | - | Through Hole | - | Solder | 0.020" (0.50mm) | - | - | - | - | - |
|
299-43-312-10-001000CONN IC DIP SOCKET 12POS GOLD |
3 | - |
|
数据表
|
299 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 12 (2 x 6) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
110-43-628-41-801000CONN IC DIP SOCKET 28POS GOLD |
6 | - |
|
数据表
|
110 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame, Decoupling Capacitor | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
12-823-90CCONN IC DIP SOCKET 12POS GOLD |
2 | - |
|
数据表
|
Vertisockets™ 800 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 12 (2 x 6) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
169-PRS13001-12CONN SOCKET PGA ZIF GOLD |
1 | - |
|
数据表
|
PRS | Bulk | Active | PGA, ZIF (ZIP) | - | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 125°C |
|
AR 24-HZL-TTCONN IC DIP SOCKET 24POS TIN |
5 | - |
|
数据表
|
- | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester | -40°C ~ 105°C |
|
SA246000CONN IC DIP SOCKET 24POS GOLD |
7 | - |
|
数据表
|
SA | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Thermoplastic, Polyester, Glass Filled | -40°C ~ 105°C |
|
382CONN IC DIP SOCKET 28POS |
22 | - |
|
数据表
|
- | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
28-3518-10CONN IC DIP SOCKET 28POS GOLD |
4 | - |
|
数据表
|
518 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
|
|
MIKROE-42540 PIN ZIF SOCKET |
8 | - |
|
数据表
|
- | Box | Active | DIP, ZIF (ZIP) | 40 (2 x 20) | - | - | - | - | Through Hole | Closed Frame | Solder | - | - | - | - | - | - |
|
4732COVER PWR TRANS .210"ID TO-3 |
3 | - |
|
数据表
|
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
214-7390-55-1902CONN SOCKET SOIC 14POS GOLD |
1 | - |
|
数据表
|
Textool™ | Bulk | Active | SOIC | 14 (2 x 7) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES), Glass Filled | -55°C ~ 150°C |
|
228-1371-00-0602JCONN IC DIP SOCKET ZIF 28POS GLD |
3 | - |
|
数据表
|
Textool™ | Tray | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
