IC 插座
| 图片 | 厂商型号 | 可用性 | 价格 | 数量 | 数据表 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量(网格) | 配对间距 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 端接方式 | 引脚间距 | 触点表面处理 - 引脚 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 | 外壳材料 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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614-43-628-31-012000CONN IC DIP SOCKET 28POS GOLD |
8 | - |
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614 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
123-43-316-41-801000CONN IC DIP SOCKET 16POS GOLD |
19 | - |
|
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123 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame, Decoupling Capacitor | Wire Wrap | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
117-43-448-41-005000CONN IC DIP SOCKET 48POS GOLD |
6 | - |
|
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117 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 48 (2 x 24) | 0.070" (1.78mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.070" (1.78mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
614-41-640-31-012000SKT CARRIER PGA |
2 | - |
|
|
614 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
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117-93-668-41-005000CONN IC DIP SOCKET 68POS GOLD |
3 | - |
|
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117 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 68 (2 x 34) | 0.070" (1.78mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.070" (1.78mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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1871554-1CONN SKT 1207-F RIGHT LEVER SMD |
5 | - |
|
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- | Bulk | Obsolete | LGA | 1207 (33 x 34) | 0.043" (1.09mm) | Gold | - | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.043" (1.09mm) | Gold | - | Copper Alloy | Thermoplastic | - |
|
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299-43-630-10-002000CONN IC DIP SOCKET 30POS GOLD |
1 | - |
|
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299 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 30 (2 x 15) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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200-6321-9UN-1900CONN SOCKET PGA ZIF 441POS GOLD |
1 | - |
|
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Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 441 (21 x 21) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |
|
S583-11-255-01-005410255 POSITION BGA SOCKET LOADED W |
1 | - |
|
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* | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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SMA310-CGR5PB-AConn SMA RCP 0Hz to 3GHz 50Ohm |
5 | - |
|
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- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |

