IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
22-0503-21

22-0503-21

CONN SOCKET SIP 22POS GOLD

Aries Electronics

0 -
22-0503-21

数据表

0503 Bulk Active SIP 22 (1 x 22) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
22-0503-31

22-0503-31

CONN SOCKET SIP 22POS GOLD

Aries Electronics

0 -
22-0503-31

数据表

0503 Bulk Active SIP 22 (1 x 22) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
16-3508-211

16-3508-211

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

0 -
16-3508-211

数据表

508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
16-3508-311

16-3508-311

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

0 -
16-3508-311

数据表

508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
116-47-652-41-006000

116-47-652-41-006000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

0 -
116-47-652-41-006000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
HLS-0610-T-2

HLS-0610-T-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0610-T-2

数据表

HLS Bulk Active SIP 60 (6 x 10) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
APH-1814-G-R

APH-1814-G-R

APH-1814-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0514-G-R

APH-0514-G-R

APH-0514-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1514-G-R

APH-1514-G-R

APH-1514-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1714-G-R

APH-1714-G-R

APH-1714-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0814-G-R

APH-0814-G-R

APH-0814-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1614-G-R

APH-1614-G-R

APH-1614-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0714-G-R

APH-0714-G-R

APH-0714-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
111-47-952-41-001000

111-47-952-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

0 -
111-47-952-41-001000

数据表

111 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
126-93-318-41-003000

126-93-318-41-003000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

0 -
126-93-318-41-003000

数据表

126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
126-43-318-41-003000

126-43-318-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-43-318-41-003000

数据表

126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
36-3513-11H

36-3513-11H

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

0 -
36-3513-11H

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
28-7440-10

28-7440-10

CONN SOCKET SIP 28POS TIN

Aries Electronics

0 -
28-7440-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 28 (1 x 28) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
28-7770-10

28-7770-10

CONN SOCKET SIP 28POS TIN

Aries Electronics

0 -
28-7770-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 28 (1 x 28) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
28-7850-10

28-7850-10

CONN SOCKET SIP 28POS TIN

Aries Electronics

0 -
28-7850-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 28 (1 x 28) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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