IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

全部重置
全部应用
结果
图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
104-13-328-41-780000

104-13-328-41-780000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

0 -
104-13-328-41-780000

数据表

104 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic -
104-13-428-41-780000

104-13-428-41-780000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

0 -
104-13-428-41-780000

数据表

104 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic -
104-13-628-41-780000

104-13-628-41-780000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

0 -
104-13-628-41-780000

数据表

104 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic -
APH-0428-T-H

APH-0428-T-H

APH-0428-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1428-T-H

APH-1428-T-H

APH-1428-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0928-T-H

APH-0928-T-H

APH-0928-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0628-T-H

APH-0628-T-H

APH-0628-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0228-T-H

APH-0228-T-H

APH-0228-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1628-T-H

APH-1628-T-H

APH-1628-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1728-T-H

APH-1728-T-H

APH-1728-T-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
115-47-964-41-001000

115-47-964-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

0 -
115-47-964-41-001000

数据表

115 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
HLS-0318-G-2

HLS-0318-G-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0318-G-2

数据表

HLS Tube Active SIP 54 (3 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
614-93-432-31-018000

614-93-432-31-018000

SOCKET CARRIER LOWPRO .400 32POS

Mill-Max Manufacturing Corp.

0 -
614-93-432-31-018000

数据表

614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-93-632-31-018000

614-93-632-31-018000

SOCKET CARRIER LOWPRO .600 32POS

Mill-Max Manufacturing Corp.

0 -
614-93-632-31-018000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-43-432-31-018000

614-43-432-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-43-432-31-018000

数据表

614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-43-632-31-018000

614-43-632-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-43-632-31-018000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
122-13-322-41-001000

122-13-322-41-001000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.

0 -
122-13-322-41-001000

数据表

122 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
122-13-422-41-001000

122-13-422-41-001000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.

0 -
122-13-422-41-001000

数据表

122 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-93-650-41-105000

110-93-650-41-105000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.

0 -
110-93-650-41-105000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-93-950-41-105000

110-93-950-41-105000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.

0 -
110-93-950-41-105000

数据表

110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
深圳市宝利科技有限公司

搜索

深圳市宝利科技有限公司

产品

深圳市宝利科技有限公司

电话

深圳市宝利科技有限公司

用户