IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

全部重置
全部应用
结果
图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
116-43-642-41-007000

116-43-642-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-642-41-007000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APH-1916-G-R

APH-1916-G-R

APH-1916-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0916-G-R

APH-0916-G-R

APH-0916-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1416-G-R

APH-1416-G-R

APH-1416-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0516-G-R

APH-0516-G-R

APH-0516-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1016-G-R

APH-1016-G-R

APH-1016-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1516-G-R

APH-1516-G-R

APH-1516-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1116-G-R

APH-1116-G-R

APH-1116-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1616-G-R

APH-1616-G-R

APH-1616-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0416-G-R

APH-0416-G-R

APH-0416-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1716-G-R

APH-1716-G-R

APH-1716-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
123-93-324-41-801000

123-93-324-41-801000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

0 -
123-93-324-41-801000

数据表

123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
123-43-324-41-801000

123-43-324-41-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
123-43-324-41-801000

数据表

123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
122-13-314-41-801000

122-13-314-41-801000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

0 -
122-13-314-41-801000

数据表

122 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
65-PGM10008-11

65-PGM10008-11

CONN SOCKET PGA GOLD

Aries Electronics

0 -
65-PGM10008-11

数据表

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
110-41-310-61-001000

110-41-310-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -

-

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-91-310-61-001000

110-91-310-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -

-

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-41-640-61-001000

110-41-640-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -

-

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
104-11-640-41-780000

104-11-640-41-780000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
104-11-640-41-780000

数据表

104 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-650-41-006000

116-93-650-41-006000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.

0 -
116-93-650-41-006000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
深圳市宝利科技有限公司

搜索

深圳市宝利科技有限公司

产品

深圳市宝利科技有限公司

电话

深圳市宝利科技有限公司

用户