IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

全部重置
全部应用
结果
图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
510-93-068-10-041001

510-93-068-10-041001

PGA SOCK 68PIN 10X10 SOLDER TL

Mill-Max Manufacturing Corp.

60 -
510-93-068-10-041001

数据表

510 Tube Active PGA 68 (10 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
510-93-068-11-061001

510-93-068-11-061001

PGA SOCK 68PIN 11X11 SOLDER TL

Mill-Max Manufacturing Corp.

49 -
510-93-068-11-061001

数据表

510 Tube Active PGA 68 (11 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
510-91-108-12-051001

510-91-108-12-051001

SOCKET SOLDERTAIL 108-PGA

Mill-Max Manufacturing Corp.

51 -
510-91-108-12-051001

数据表

510 Tube Active PGA 108 (12 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
322-13-132-41-001000

322-13-132-41-001000

SOCKET 2 LEVEL WRAPOST SIP 32POS

Mill-Max Manufacturing Corp.

51 -
322-13-132-41-001000

数据表

322 Tube Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
315-13-164-41-003000

315-13-164-41-003000

SOCKET LOW PROFILE SIP 64POS

Mill-Max Manufacturing Corp.

48 -
315-13-164-41-003000

数据表

315 Tube Active SIP 64 (1 x 64) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
510-13-068-11-061001

510-13-068-11-061001

SOCKET SOLDERTAIL 68-PGA

Mill-Max Manufacturing Corp.

42 -
510-13-068-11-061001

数据表

510 Tube Active PGA 68 (11 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
510-43-128-13-041001

510-43-128-13-041001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

44 -
510-43-128-13-041001

数据表

510 Tube Active PGA 128 (13 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
510-91-176-15-061002

510-91-176-15-061002

SOCKET SOLDERTAIL 176-PGA

Mill-Max Manufacturing Corp.

49 -
510-91-176-15-061002

数据表

510 Tube Active PGA 176 (15 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
510-93-145-15-081001

510-93-145-15-081001

CONN SOCKET PGA 145POS GOLD

Mill-Max Manufacturing Corp.

40 -
510-93-145-15-081001

数据表

510 Tube Active PGA 145 (15 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
510-93-168-17-101002

510-93-168-17-101002

PGA DOCK 168PIN 17X17 SOLDER TL

Mill-Max Manufacturing Corp.

57 -
510-93-168-17-101002

数据表

510 Tube Active PGA 168 (17 x 17) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
123-13-964-41-001000

123-13-964-41-001000

CONN IC DIP SOCKET 64POS GOLD

Mill-Max Manufacturing Corp.

49 -
123-13-964-41-001000

数据表

123 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
224-7397-55-1902

224-7397-55-1902

CONN SOCKET SOIC 24POS GOLD

3M

16 -
224-7397-55-1902

数据表

Textool™ Bulk Active SOIC 24 (2 x 12) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES), Glass Filled -55°C ~ 150°C
714-43-101-31-018000

714-43-101-31-018000

CONN SOCKET SIP 1POS GOLD

Mill-Max Manufacturing Corp.

788 -
714-43-101-31-018000

数据表

714 Bulk Active SIP 1 (1 x 1) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
822516-3

822516-3

CONN SOCKET PLCC 20POS TIN

TE Connectivity AMP Connectors

0 -
822516-3

数据表

- Tube Obsolete PLCC 20 (4 x 5) 0.050" (1.27mm) Tin 100.0µin (2.54µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 100.0µin (2.54µm) Phosphor Bronze Thermoplastic -
1825094-6

1825094-6

CONN IC DIP SOCKET 20POS GOLD

TE Connectivity AMP Connectors

0 -
1825094-6

数据表

Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 125°C
211-1-32-006

211-1-32-006

CONN IC DIP SOCKET 32POS GOLD

CNC Tech

86 -
211-1-32-006

数据表

- Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT) -55°C ~ 105°C
346-93-107-41-013000

346-93-107-41-013000

CONN SOCKET SIP 7POS GOLD

Mill-Max Manufacturing Corp.

76 -
346-93-107-41-013000

数据表

346 Bulk Active SIP 7 (1 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
4-1571552-8

4-1571552-8

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors

0 -
4-1571552-8

数据表

800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
346-93-110-41-013000

346-93-110-41-013000

CONN SOCKET SIP 10POS GOLD

Mill-Max Manufacturing Corp.

27 -
346-93-110-41-013000

数据表

346 Tube Active SIP 10 (1 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-43-316-10-004000

110-43-316-10-004000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.

66 -
110-43-316-10-004000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8), 4 Loaded 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
深圳市宝利科技有限公司

搜索

深圳市宝利科技有限公司

产品

深圳市宝利科技有限公司

电话

深圳市宝利科技有限公司

用户