IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
HLS-0316-T-12

HLS-0316-T-12

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0316-T-12

数据表

HLS Tube Active SIP 48 (3 x 16) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
612-43-964-41-003000

612-43-964-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-43-964-41-003000

数据表

612 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
612-93-964-41-003000

612-93-964-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-93-964-41-003000

数据表

612 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APH-0426-G-T

APH-0426-G-T

APH-0426-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1426-G-T

APH-1426-G-T

APH-1426-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1526-G-T

APH-1526-G-T

APH-1526-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0626-G-T

APH-0626-G-T

APH-0626-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1326-G-T

APH-1326-G-T

APH-1326-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0326-G-T

APH-0326-G-T

APH-0326-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1626-G-T

APH-1626-G-T

APH-1626-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
110-43-652-61-001000

110-43-652-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -

-

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
122-11-950-41-001000

122-11-950-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
122-11-950-41-001000

数据表

122 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-43-650-61-003000

116-43-650-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -

-

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-650-61-003000

116-93-650-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -

-

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-43-642-61-008000

116-43-642-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -

-

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
117-43-656-61-005000

117-43-656-61-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -

-

117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 56 (2 x 28) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APA-632-G-Q

APA-632-G-Q

ADAPTER PLUG

Samtec Inc.

0 -
APA-632-G-Q

数据表

APA Tube Active - 32 (2 x 16) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
517-83-369-18-091111

517-83-369-18-091111

CONN SOCKET PGA 369POS GOLD

Preci-Dip

0 -
517-83-369-18-091111

数据表

517 Bulk Active PGA 369 (18 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
115-43-648-61-001000

115-43-648-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -

-

115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-93-322-61-801000

110-93-322-61-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -

-

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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