IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
APH-0634-G-T

APH-0634-G-T

APH-0634-G-T

Samtec Inc.

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* - Active - - - - - - - - - - - - - - -
116-43-650-61-008000

116-43-650-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

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-

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-650-61-008000

116-93-650-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -

-

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
117-93-668-61-005000

117-93-668-61-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -

-

117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 68 (2 x 34) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-43-952-61-003000

116-43-952-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -

-

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-952-61-003000

116-93-952-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -

-

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
546-87-321-17-101147

546-87-321-17-101147

CONN SOCKET PGA 321POS GOLD

Preci-Dip

0 -
546-87-321-17-101147

数据表

546 Bulk Active PGA 321 (17 x 17) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
546-87-321-19-121147

546-87-321-19-121147

CONN SOCKET PGA 321POS GOLD

Preci-Dip

0 -
546-87-321-19-121147

数据表

546 Bulk Active PGA 321 (19 x 19) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
APH-0526-G-H

APH-0526-G-H

APH-0526-G-H

Samtec Inc.

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-

* - Active - - - - - - - - - - - - - - -
APH-1926-G-H

APH-1926-G-H

APH-1926-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1526-G-H

APH-1526-G-H

APH-1526-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0826-G-H

APH-0826-G-H

APH-0826-G-H

Samtec Inc.

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-

* - Active - - - - - - - - - - - - - - -
APH-1826-G-H

APH-1826-G-H

APH-1826-G-H

Samtec Inc.

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-

* - Active - - - - - - - - - - - - - - -
APH-1326-G-H

APH-1326-G-H

APH-1326-G-H

Samtec Inc.

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-

* - Active - - - - - - - - - - - - - - -
APH-1226-G-H

APH-1226-G-H

APH-1226-G-H

Samtec Inc.

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-

* - Active - - - - - - - - - - - - - - -
APH-0226-G-H

APH-0226-G-H

APH-0226-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0326-G-H

APH-0326-G-H

APH-0326-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
517-83-419-19-111111

517-83-419-19-111111

CONN SOCKET PGA 419POS GOLD

Preci-Dip

0 -
517-83-419-19-111111

数据表

517 Bulk Active PGA 419 (19 x 19) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
48-6556-31

48-6556-31

UNIV TEST SOCKET RECEPT 6556

Aries Electronics

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-

6556 - Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled 150°C
24-6556-40

24-6556-40

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
24-6556-40

数据表

6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
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