IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
116-93-950-61-007000

116-93-950-61-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -

-

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
558-10-192M16-001104

558-10-192M16-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip

0 -
558-10-192M16-001104

数据表

558 Bulk Active BGA 192 (16 x 16) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
550-80-296-19-131135

550-80-296-19-131135

PGA SOLDER TAIL

Preci-Dip

0 -
550-80-296-19-131135

数据表

550 Bulk Active PGA 296 (19 x 19) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-43-964-61-006000

116-43-964-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -

-

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-964-61-006000

116-93-964-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -

-

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
518-77-192M16-001105

518-77-192M16-001105

CONN SOCKET PGA 192POS GOLD

Preci-Dip

0 -
518-77-192M16-001105

数据表

518 Bulk Active PGA 192 (16 x 16) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
APH-0434-G-H

APH-0434-G-H

APH-0434-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1834-G-H

APH-1834-G-H

APH-1834-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1534-G-H

APH-1534-G-H

APH-1534-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1234-G-H

APH-1234-G-H

APH-1234-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0234-G-H

APH-0234-G-H

APH-0234-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0734-G-H

APH-0734-G-H

APH-0734-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0834-G-H

APH-0834-G-H

APH-0834-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APA-640-G-Q

APA-640-G-Q

ADAPTER PLUG

Samtec Inc.

0 -
APA-640-G-Q

数据表

APA Tube Active - 40 (2 x 20) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
APA-640-G-C

APA-640-G-C

ADAPTER PLUG

Samtec Inc.

0 -
APA-640-G-C

数据表

APA Bulk Active - 40 (2 x 20) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
APO-640-G-C

APO-640-G-C

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-640-G-C

数据表

APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
48-6503-31

48-6503-31

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics

0 -
48-6503-31

数据表

503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
APH-1828-G-T

APH-1828-G-T

APH-1828-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1428-G-T

APH-1428-G-T

APH-1428-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1528-G-T

APH-1528-G-T

APH-1528-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
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