IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
510-93-145-15-081002

510-93-145-15-081002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

0 -
510-93-145-15-081002

数据表

510 Tube Active PGA 145 (15 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
550-10-225-18-091101

550-10-225-18-091101

PGA SOLDER TAIL

Preci-Dip

0 -
550-10-225-18-091101

数据表

550 Bulk Active PGA 225 (18 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
48-6556-21

48-6556-21

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics

0 -
48-6556-21

数据表

6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
120-PGM13015-11

120-PGM13015-11

CONN SOCKET PGA GOLD

Aries Electronics

0 -
120-PGM13015-11

数据表

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
517-83-463-19-101111

517-83-463-19-101111

CONN SOCKET PGA 463POS GOLD

Preci-Dip

0 -
517-83-463-19-101111

数据表

517 Bulk Active PGA 463 (19 x 19) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
APH-0430-G-T

APH-0430-G-T

APH-0430-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1430-G-T

APH-1430-G-T

APH-1430-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1930-G-T

APH-1930-G-T

APH-1930-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1630-G-T

APH-1630-G-T

APH-1630-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0830-G-T

APH-0830-G-T

APH-0830-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1130-G-T

APH-1130-G-T

APH-1130-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1730-G-T

APH-1730-G-T

APH-1730-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
ICO-648-JGG

ICO-648-JGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-648-JGG

数据表

ICO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
APH-1338-G-T

APH-1338-G-T

APH-1338-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1838-G-T

APH-1838-G-T

APH-1838-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1438-G-T

APH-1438-G-T

APH-1438-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1038-G-T

APH-1038-G-T

APH-1038-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1938-G-T

APH-1938-G-T

APH-1938-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1538-G-T

APH-1538-G-T

APH-1538-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1738-G-T

APH-1738-G-T

APH-1738-G-T

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
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