IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
APH-1328-G-H

APH-1328-G-H

APH-1328-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0228-G-H

APH-0228-G-H

APH-0228-G-H

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
1437522-4

1437522-4

CONN SOCKET PGA 321POS GOLD

TE Connectivity AMP Connectors

0 -
1437522-4

数据表

- Bulk Active PGA 321 (19 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead - Copper Alloy Thermoplastic, Polyester -55°C ~ 105°C
APH-0534-G-R

APH-0534-G-R

APH-0534-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0934-G-R

APH-0934-G-R

APH-0934-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1034-G-R

APH-1034-G-R

APH-1034-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0734-G-R

APH-0734-G-R

APH-0734-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-1334-G-R

APH-1334-G-R

APH-1334-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
APH-0434-G-R

APH-0434-G-R

APH-0434-G-R

Samtec Inc.

0 -

-

* - Active - - - - - - - - - - - - - - -
116-43-950-61-008000

116-43-950-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -

-

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-950-61-008000

116-93-950-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -

-

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-652-61-001000

116-93-652-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -

-

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-87-281-19-001112

614-87-281-19-001112

CONN SOCKET PGA 281POS GOLD

Preci-Dip

0 -
614-87-281-19-001112

数据表

614 Bulk Active PGA 281 (19 x 19) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
514-83-279-19-081117

514-83-279-19-081117

CONN SOCKET PGA 279POS GOLD

Preci-Dip

0 -
514-83-279-19-081117

数据表

514 Bulk Active PGA 279 (19 x 19) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
44-3570-11

44-3570-11

CONN IC DIP SOCKET ZIF 44POS GLD

Aries Electronics

0 -
44-3570-11

数据表

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
44-3574-11

44-3574-11

CONN IC DIP SOCKET ZIF 44POS TIN

Aries Electronics

0 -
44-3574-11

数据表

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
44-6570-11

44-6570-11

CONN IC DIP SOCKET ZIF 44POS GLD

Aries Electronics

0 -
44-6570-11

数据表

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
44-6572-11

44-6572-11

CONN IC DIP SOCKET ZIF 44POS TIN

Aries Electronics

0 -
44-6572-11

数据表

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
44-6573-11

44-6573-11

CONN IC DIP SOCKET ZIF 44POS TIN

Aries Electronics

0 -
44-6573-11

数据表

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
44-6574-11

44-6574-11

CONN IC DIP SOCKET ZIF 44POS TIN

Aries Electronics

0 -
44-6574-11

数据表

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
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