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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
550-10-356M26-001152

550-10-356M26-001152

BGA SOLDER TAIL

Preci-Dip

0 -
550-10-356M26-001152

数据表

550 Bulk Active BGA 356 (26 x 26) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
546-87-528-21-121147

546-87-528-21-121147

CONN SOCKET PGA 528POS GOLD

Preci-Dip

0 -
546-87-528-21-121147

数据表

546 Bulk Active PGA 528 (21 x 21) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
550-10-357M19-001152

550-10-357M19-001152

BGA SOLDER TAIL

Preci-Dip

0 -
550-10-357M19-001152

数据表

550 Bulk Active BGA 357 (19 x 19) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
546-87-545-17-000147

546-87-545-17-000147

CONN SOCKET PGA 545POS GOLD

Preci-Dip

0 -
546-87-545-17-000147

数据表

546 Bulk Active PGA 545 (17 x 17) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
32-3551-16

32-3551-16

CONN IC DIP SOCKET ZIF 32POS

Aries Electronics

0 -
32-3551-16

数据表

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
32-3552-16

32-3552-16

CONN IC DIP SOCKET ZIF 32POS

Aries Electronics

0 -
32-3552-16

数据表

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
32-3553-16

32-3553-16

CONN IC DIP SOCKET ZIF 32POS

Aries Electronics

0 -
32-3553-16

数据表

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
32-6552-16

32-6552-16

CONN IC DIP SOCKET ZIF 32POS

Aries Electronics

0 -
32-6552-16

数据表

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
32-6553-16

32-6553-16

CONN IC DIP SOCKET ZIF 32POS

Aries Electronics

0 -
32-6553-16

数据表

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
32-3554-16

32-3554-16

CONN IC DIP SOCKET ZIF 32POS

Aries Electronics

0 -
32-3554-16

数据表

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
550-10-360M19-001152

550-10-360M19-001152

BGA SOLDER TAIL

Preci-Dip

0 -
550-10-360M19-001152

数据表

550 Bulk Active BGA 360 (19 x 19) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
110-88-320-41-530000

110-88-320-41-530000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-88-320-41-530000

数据表

110 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
210-83-306-41-101000

210-83-306-41-101000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
210-83-306-41-101000

数据表

210 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 300.0µin (7.62µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-88-316-41-530000

110-88-316-41-530000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-88-316-41-530000

数据表

110 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
42-6556-40

42-6556-40

CONN IC DIP SOCKET 42POS GOLD

Aries Electronics

0 -
42-6556-40

数据表

6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
550-10-520M31-001166

550-10-520M31-001166

BGA PIN ADAPTER 1.27MM SMD

Preci-Dip

0 -
550-10-520M31-001166

数据表

550 Bulk Active BGA 520 (31 x 31) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
210-88-306-41-001000

210-88-306-41-001000

STANDRD SOLDER TAIL DIP SOCKET

Mill-Max Manufacturing Corp.

0 -

-

- Tube Active - - - - - - - - - - - - - - -
514-87-500M30-001148

514-87-500M30-001148

CONN SOCKET BGA 500POS GOLD

Preci-Dip

0 -
514-87-500M30-001148

数据表

514 Bulk Active BGA 500 (30 x 30) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
144-PGM12001-41

144-PGM12001-41

CONN SOCKET PGA GOLD

Aries Electronics

0 -
144-PGM12001-41

数据表

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
514-83-388M26-001148

514-83-388M26-001148

CONN SOCKET BGA 388POS GOLD

Preci-Dip

0 -
514-83-388M26-001148

数据表

514 Bulk Active BGA 388 (26 x 26) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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