IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
110-88-314-41-001000

110-88-314-41-001000

STANDRD SOLDER TAIL DIP SOCKET

Mill-Max Manufacturing Corp.

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110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Thermoplastic -55°C ~ 125°C
110-83-314-41-530000

110-83-314-41-530000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

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110 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 300.0µin (7.62µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-88-316-41-001000

110-88-316-41-001000

STANDRD SOLDER TAIL DIP SOCKET

Mill-Max Manufacturing Corp.

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-

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Thermoplastic -55°C ~ 125°C
614-83-296-19-131144

614-83-296-19-131144

CONN SOCKET PGA 296POS GOLD

Preci-Dip

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614-83-296-19-131144

数据表

614 Bulk Active PGA 296 (19 x 19) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
546-83-419-19-111147

546-83-419-19-111147

CONN SOCKET PGA 419POS GOLD

Preci-Dip

0 -
546-83-419-19-111147

数据表

546 Bulk Active PGA 419 (19 x 19) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
210-83-306-41-001000

210-83-306-41-001000

STANDRD SOLDER TAIL DIP SOCKET

Mill-Max Manufacturing Corp.

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-

210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 300.0µin (7.62µm) Beryllium Copper Thermoplastic -55°C ~ 125°C
514-87-504M29-001148

514-87-504M29-001148

CONN SOCKET BGA 504POS GOLD

Preci-Dip

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514-87-504M29-001148

数据表

514 Bulk Active BGA 504 (29 x 29) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
546-83-420-19-111147

546-83-420-19-111147

CONN SOCKET PGA 420POS GOLD

Preci-Dip

0 -
546-83-420-19-111147

数据表

546 Bulk Active PGA 420 (19 x 19) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-83-308-41-001000

110-83-308-41-001000

STANDRD SOLDER TAIL DIP SOCKET

Mill-Max Manufacturing Corp.

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-

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Thermoplastic -55°C ~ 125°C
210-83-308-41-001000

210-83-308-41-001000

STANDRD SOLDER TAIL DIP SOCKET

Mill-Max Manufacturing Corp.

0 -
210-83-308-41-001000

数据表

210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 300.0µin (7.62µm) Brass Thermoplastic -55°C ~ 125°C
510-13-209-17-081002

510-13-209-17-081002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

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510-13-209-17-081002

数据表

510 Bulk Active PGA 209 (17 x 17) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-88-318-41-001000

110-88-318-41-001000

STANDRD SOLDER TAIL DIP SOCKET

Mill-Max Manufacturing Corp.

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-

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Thermoplastic -55°C ~ 125°C
110-83-320-41-530000

110-83-320-41-530000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-83-320-41-530000

数据表

110 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 300.0µin (7.62µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
210-83-320-41-101000

210-83-320-41-101000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
210-83-320-41-101000

数据表

210 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 300.0µin (7.62µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
210-83-624-41-101000

210-83-624-41-101000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

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210-83-624-41-101000

数据表

210 Bulk Obsolete DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 300.0µin (7.62µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-88-640-41-530000

110-88-640-41-530000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-88-640-41-530000

数据表

110 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-88-624-41-001000

110-88-624-41-001000

STANDRD SOLDER TAIL DIP SOCKET

Mill-Max Manufacturing Corp.

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-

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Thermoplastic -55°C ~ 125°C
28-536-11

28-536-11

CONN SOCKET PLCC ZIF 28POS GOLD

Aries Electronics

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536 - Obsolete PLCC, ZIF (ZIP) 28 (4 x 7) 0.050" (1.27mm) Gold 12.0µin (0.30µm) - Through Hole Open Frame - - - - - - -
144-PGM12001-51

144-PGM12001-51

CONN SOCKET PGA GOLD

Aries Electronics

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144-PGM12001-51

数据表

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
HLS-0420-G-12

HLS-0420-G-12

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

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HLS-0420-G-12

数据表

HLS Bulk Active SIP 80 (4 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
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