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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
518-77-357M19-001105

518-77-357M19-001105

CONN SOCKET PGA 357POS GOLD

Preci-Dip

0 -
518-77-357M19-001105

数据表

518 Bulk Active PGA 357 (19 x 19) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
110-33-628-41-530000

110-33-628-41-530000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

0 -

-

110 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
210-33-628-41-101000

210-33-628-41-101000

SOCKET IC CLOSED FRM .300 28POS

Mill-Max Manufacturing Corp.

0 -

-

210 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
210-33-316-41-001000

210-33-316-41-001000

STANDRD SOLDER TAIL DIP SOCKET

Mill-Max Manufacturing Corp.

0 -
210-33-316-41-001000

数据表

210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Thermoplastic -55°C ~ 125°C
110-33-316-41-001000

110-33-316-41-001000

STANDRD SOLDER TAIL DIP SOCKET

Mill-Max Manufacturing Corp.

0 -

-

- Tube Active - - - - - - - - - - - - - - -
36-3551-16

36-3551-16

CONN IC DIP SOCKET ZIF 36POS

Aries Electronics

0 -
36-3551-16

数据表

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
558-10-360M19-001104

558-10-360M19-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip

0 -
558-10-360M19-001104

数据表

558 Bulk Active BGA 360 (19 x 19) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
518-77-352M26-001106

518-77-352M26-001106

CONN SOCKET PGA 352POS GOLD

Preci-Dip

0 -
518-77-352M26-001106

数据表

518 Bulk Active PGA 352 (26 x 26) 0.050" (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
1109042

1109042

537 ZIF TEST SCKT LIVE BUG TYPE

Aries Electronics

0 -
1109042

数据表

- - Active - - - - - - - - - - - - - - -
514-83-432M31-001148

514-83-432M31-001148

CONN SOCKET BGA 432POS GOLD

Preci-Dip

0 -
514-83-432M31-001148

数据表

514 Bulk Active BGA 432 (31 x 31) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
518-77-360M19-001105

518-77-360M19-001105

CONN SOCKET PGA 360POS GOLD

Preci-Dip

0 -
518-77-360M19-001105

数据表

518 Bulk Active PGA 360 (19 x 19) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
514-87-560M33-001148

514-87-560M33-001148

CONN SOCKET BGA 560POS GOLD

Preci-Dip

0 -
514-87-560M33-001148

数据表

514 Bulk Active BGA 560 (33 x 33) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
210-33-320-41-001000

210-33-320-41-001000

STANDRD SOLDER TAIL DIP SOCKET

Mill-Max Manufacturing Corp.

0 -

-

- Tube Active - - - - - - - - - - - - - - -
518-77-356M26-001106

518-77-356M26-001106

CONN SOCKET PGA 356POS GOLD

Preci-Dip

0 -
518-77-356M26-001106

数据表

518 Bulk Active PGA 356 (26 x 26) 0.050" (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
281-PGM18037-11

281-PGM18037-11

CONN SOCKET PGA GOLD

Aries Electronics

0 -
281-PGM18037-11

数据表

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
210-33-632-41-101000

210-33-632-41-101000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
210-33-632-41-101000

数据表

210 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-33-318-41-001000

110-33-318-41-001000

STANDRD SOLDER TAIL DIP SOCKET

Mill-Max Manufacturing Corp.

0 -

-

- Tube Active - - - - - - - - - - - - - - -
210-33-318-41-001000

210-33-318-41-001000

STANDRD SOLDER TAIL DIP SOCKET

Mill-Max Manufacturing Corp.

0 -

-

- Tube Active - - - - - - - - - - - - - - -
518-77-357M19-001106

518-77-357M19-001106

CONN SOCKET PGA 357POS GOLD

Preci-Dip

0 -
518-77-357M19-001106

数据表

518 Bulk Active PGA 357 (19 x 19) 0.050" (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
558-10-388M26-001101

558-10-388M26-001101

PGA SOLDER TAIL 1.27MM

Preci-Dip

0 -
558-10-388M26-001101

数据表

558 Bulk Active PGA 388 (26 x 26) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
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