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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
7010321946

7010321946

TEXTOOLTEST & BURN-IN BALL GRID

3M

0 -

-

- Bulk Active - - - - - - - - - - - - - - -
558-10-420M26-001101

558-10-420M26-001101

PGA SOLDER TAIL 1.27MM

Preci-Dip

0 -
558-10-420M26-001101

数据表

558 Bulk Active PGA 420 (26 x 26) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
42-6556-41

42-6556-41

CONN IC DIP SOCKET 42POS GOLD

Aries Electronics

0 -
42-6556-41

数据表

6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
518-77-388M26-001106

518-77-388M26-001106

CONN SOCKET PGA 388POS GOLD

Preci-Dip

0 -
518-77-388M26-001106

数据表

518 Bulk Active PGA 388 (26 x 26) 0.050" (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
514-83-478M26-131148

514-83-478M26-131148

CONN SOCKET BGA 478POS GOLD

Preci-Dip

0 -
514-83-478M26-131148

数据表

514 Bulk Active BGA 478 (26 x 26) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
558-10-400M20-000104

558-10-400M20-000104

BGA SURFACE MOUNT 1.27MM

Preci-Dip

0 -
558-10-400M20-000104

数据表

558 Bulk Active BGA 400 (20 x 20) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
223-33-320-41-001000

223-33-320-41-001000

STANDARD WIRE WRAP DIP SOCKET

Mill-Max Manufacturing Corp.

0 -

-

- Tube Active - - - - - - - - - - - - - - -
514-83-480M29-001148

514-83-480M29-001148

CONN SOCKET BGA 480POS GOLD

Preci-Dip

0 -
514-83-480M29-001148

数据表

514 Bulk Active BGA 480 (29 x 29) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
518-77-400M20-000105

518-77-400M20-000105

CONN SOCKET PGA 400POS GOLD

Preci-Dip

0 -
518-77-400M20-000105

数据表

518 Bulk Active PGA 400 (20 x 20) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
110-33-640-41-001000

110-33-640-41-001000

STANDRD SOLDER TAIL DIP SOCKET

Mill-Max Manufacturing Corp.

0 -

-

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Thermoplastic -55°C ~ 125°C
210-33-640-41-001000

210-33-640-41-001000

STANDRD SOLDER TAIL DIP SOCKET

Mill-Max Manufacturing Corp.

0 -
210-33-640-41-001000

数据表

210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Thermoplastic -55°C ~ 125°C
65-PRS10008-12

65-PRS10008-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0 -
65-PRS10008-12

数据表

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
550-10-652M35-001166

550-10-652M35-001166

BGA PIN ADAPTER 1.27MM SMD

Preci-Dip

0 -
550-10-652M35-001166

数据表

550 Bulk Active BGA 652 (35 x 35) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
66-PLS11054-12

66-PLS11054-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0 -
66-PLS11054-12

数据表

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
550-10-456M26-001152

550-10-456M26-001152

BGA SOLDER TAIL

Preci-Dip

0 -
550-10-456M26-001152

数据表

550 Bulk Active BGA 456 (26 x 26) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
546-83-528-21-121147

546-83-528-21-121147

CONN SOCKET PGA 528POS GOLD

Preci-Dip

0 -
546-83-528-21-121147

数据表

546 Bulk Active PGA 528 (21 x 21) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
558-10-432M31-001101

558-10-432M31-001101

PGA SOLDER TAIL 1.27MM

Preci-Dip

0 -
558-10-432M31-001101

数据表

558 Bulk Active PGA 432 (31 x 31) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
68-PLS11033-12

68-PLS11033-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0 -
68-PLS11033-12

数据表

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
546-83-529-21-121147

546-83-529-21-121147

CONN SOCKET PGA 529POS GOLD

Preci-Dip

0 -
546-83-529-21-121147

数据表

546 Bulk Active PGA 529 (21 x 21) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
42-3554-16

42-3554-16

CONN IC DIP SOCKET ZIF 42POS

Aries Electronics

0 -
42-3554-16

数据表

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
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