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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
AR18-HZL/07-TT

AR18-HZL/07-TT

CONN IC DIP SOCKET 18POS GOLD

Assmann WSW Components

0 -
AR18-HZL/07-TT

数据表

- Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
AR14-HZL/01-TT

AR14-HZL/01-TT

CONN IC DIP SOCKET 14POS GOLD

Assmann WSW Components

0 -
AR14-HZL/01-TT

数据表

- Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
AW 127-10/Z-T

AW 127-10/Z-T

SOCKET 10 CONTACTS SINGLE ROW

Assmann WSW Components

0 -
AW 127-10/Z-T

数据表

- - Active - - - - - - - - - - - - - - -
122-87-304-41-001101

122-87-304-41-001101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

0 -
122-87-304-41-001101

数据表

122 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
123-87-304-41-001101

123-87-304-41-001101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

0 -
123-87-304-41-001101

数据表

123 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-87-306-41-105161

110-87-306-41-105161

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
110-87-306-41-105161

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
243-48-1-06

243-48-1-06

CONN IC DIP SOCKET 48POS TIN

CNC Tech

0 -
243-48-1-06

数据表

- Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 100.0µin (2.54µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
WMS-160Z

WMS-160Z

CONN IC DIP SOCKET 16POS GOLD

On Shore Technology Inc.

0 -
WMS-160Z

数据表

WMS Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame, Wash Away Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass - -40°C ~ 105°C
116-87-306-41-006101

116-87-306-41-006101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
116-87-306-41-006101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
02-2513-10

02-2513-10

CONN IC DIP SOCKET 2POS GOLD

Aries Electronics

0 -
02-2513-10

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
02-3513-10

02-3513-10

CONN IC DIP SOCKET 2POS GOLD

Aries Electronics

0 -
02-3513-10

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
02-4513-10

02-4513-10

CONN IC DIP SOCKET 2POS GOLD

Aries Electronics

0 -
02-4513-10

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
01-0518-11H

01-0518-11H

CONN SOCKET SIP 1POS GOLD

Aries Electronics

0 -
01-0518-11H

数据表

518 Bulk Active SIP 1 (1 x 1) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
A22-LCG

A22-LCG

CONN IC DIP SOCKET 22POS GOLD

Assmann WSW Components

0 -
A22-LCG

数据表

- - Obsolete DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold - - Through Hole Open Frame - 0.100" (2.54mm) Gold - - - -
2-382515-3

2-382515-3

CONN IC DIP SOCKET 20POS TIN

TE Connectivity AMP Connectors

0 -
2-382515-3

数据表

Diplomate DL Box Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 105°C
AW 127-21/Z-T

AW 127-21/Z-T

SOCKET 21 CONTACTS SINGLE ROW

Assmann WSW Components

0 -
AW 127-21/Z-T

数据表

- - Active - - - - - - - - - - - - - - -
116-87-304-41-008101

116-87-304-41-008101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

0 -
116-87-304-41-008101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-87-210-41-005101

110-87-210-41-005101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
110-87-210-41-005101

数据表

110 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
146-87-304-41-036101

146-87-304-41-036101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

0 -
146-87-304-41-036101

数据表

146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-304-41-006101

116-83-304-41-006101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

0 -
116-83-304-41-006101

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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