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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
114-83-306-41-117101

114-83-306-41-117101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
114-83-306-41-117101

数据表

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
114-83-306-41-134161

114-83-306-41-134161

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
114-83-306-41-134161

数据表

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
SIP1X12-014B

SIP1X12-014B

SIP1X12-014B-SIP SOCKET 12 CTS

Amphenol ICC (FCI)

0 -
SIP1X12-014B

数据表

SIP1x Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Tin-Lead 150.0µin (3.81µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
SIP1X10-001B

SIP1X10-001B

SIP1X10-001B-SIP SOCKET 10 CTS

Amphenol ICC (FCI)

0 -
SIP1X10-001B

数据表

SIP1x Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
HLS-0101-G-10

HLS-0101-G-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0101-G-10

数据表

HLS Tube Active SIP 1 (1 x 1) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
116-87-306-41-003101

116-87-306-41-003101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
116-87-306-41-003101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
940-99-028-24-000000

940-99-028-24-000000

CONN SOCKET PLCC 28POS TIN-LEAD

Mill-Max Manufacturing Corp.

0 -
940-99-028-24-000000

数据表

940 Tube Obsolete PLCC 28 (4 x 7) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
AR 14 HGL-TT

AR 14 HGL-TT

SOCKET

Assmann WSW Components

0 -
AR 14 HGL-TT

数据表

AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
AR20-HZL/01-TT

AR20-HZL/01-TT

CONN IC DIP SOCKET 20POS GOLD

Assmann WSW Components

0 -
AR20-HZL/01-TT

数据表

- Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
241-16-1-03

241-16-1-03

CONN IC DIP SOCKET 16POS TIN

CNC Tech

0 -
241-16-1-03

数据表

- Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
A06-LCG-T-R

A06-LCG-T-R

CONN IC DIP SOCKET 6POS GOLD

Assmann WSW Components

0 -
A06-LCG-T-R

数据表

- Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold - - Through Hole - Solder 0.100" (2.54mm) Gold - - Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
A-CCS68-Z

A-CCS68-Z

CONN SOCKET PLCC 68POS TIN

Assmann WSW Components

0 -
A-CCS68-Z

数据表

- Bag Obsolete PLCC 68 (4 x 17) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
HLS-0101-T-12

HLS-0101-T-12

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0101-T-12

数据表

HLS Tube Active SIP 1 (1 x 1) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
AW 127-24/Z-T

AW 127-24/Z-T

SOCKET 24 CONTACTS SINGLE ROW

Assmann WSW Components

0 -
AW 127-24/Z-T

数据表

- - Active - - - - - - - - - - - - - - -
110-83-306-41-605101

110-83-306-41-605101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
110-83-306-41-605101

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
03-0513-10T

03-0513-10T

CONN SOCKET SIP 3POS GOLD

Aries Electronics

0 -
03-0513-10T

数据表

0513 Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
HLS-0102-S-2

HLS-0102-S-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0102-S-2

数据表

HLS Tube Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
AR 24-HZL/7-TT

AR 24-HZL/7-TT

CONN IC DIP SOCKET 24POS TIN

Assmann WSW Components

0 -
AR 24-HZL/7-TT

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
SIP1X12-011B

SIP1X12-011B

SIP1X12-011B-SIP SOCKET 12 CTS

Amphenol ICC (FCI)

0 -
SIP1X12-011B

数据表

SIP1x Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
2-382189-1

2-382189-1

CONN IC DIP SOCKET 32POS TIN

TE Connectivity AMP Connectors

0 -
2-382189-1

数据表

Diplomate DL Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Thermoplastic -
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