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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
917-87-103-41-053101

917-87-103-41-053101

CONN TRANSIST TO-5 3POS GOLD

Preci-Dip

0 -
917-87-103-41-053101

数据表

917 Bulk Active Transistor, TO-5 3 (Round) - Gold Flash Beryllium Copper Through Hole - Solder - Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
114-87-210-41-117101

114-87-210-41-117101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
114-87-210-41-117101

数据表

114 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
SIP1X15-014B

SIP1X15-014B

SIP1X15-014B-SIP SOCKET 15 CTS

Amphenol ICC (FCI)

0 -
SIP1X15-014B

数据表

SIP1x Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Tin-Lead 150.0µin (3.81µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
SIP1X08-014B

SIP1X08-014B

SIP1X08-014B-SIP SOCKET 8 CTS

Amphenol ICC (FCI)

0 -
SIP1X08-014B

数据表

SIP1x Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Tin-Lead 150.0µin (3.81µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
612-83-306-41-001101

612-83-306-41-001101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
612-83-306-41-001101

数据表

612 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-306-41-012101

116-87-306-41-012101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
116-87-306-41-012101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-83-308-41-001101

110-83-308-41-001101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

0 -
110-83-308-41-001101

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
SIP050-1X07-160B

SIP050-1X07-160B

1X07-160B-SIP SOCKET 7 CTS

Amphenol ICC (FCI)

0 -
SIP050-1X07-160B

数据表

SIP050-1x Bulk Active SIP 7 (1 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
BU060Z-178-HT

BU060Z-178-HT

CONN IC DIP SOCKET 6POS GOLD

On Shore Technology Inc.

0 -
BU060Z-178-HT

数据表

BU-178HT Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 78.7µin (2.00µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Copper Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
130-024-000

130-024-000

CONN IC DIP SOCKET 24POS GOLD

3M

0 -
130-024-000

数据表

100 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
04-0518-00

04-0518-00

CONN SOCKET SIP 4POS GOLD

Aries Electronics

0 -
04-0518-00

数据表

518 Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
04-0518-11

04-0518-11

CONN SOCKET SIP 4POS GOLD

Aries Electronics

0 -
04-0518-11

数据表

518 Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
04-1518-11

04-1518-11

CONN IC DIP SOCKET 4POS GOLD

Aries Electronics

0 -
04-1518-11

数据表

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
05-0518-10T

05-0518-10T

CONN SOCKET SIP 5POS GOLD

Aries Electronics

0 -
05-0518-10T

数据表

518 Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
115-87-312-41-001101

115-87-312-41-001101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

0 -
115-87-312-41-001101

数据表

115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
115-87-310-41-003101

115-87-310-41-003101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
115-87-310-41-003101

数据表

115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-304-41-002101

116-83-304-41-002101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

0 -
116-83-304-41-002101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-308-41-018101

116-87-308-41-018101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

0 -
116-87-308-41-018101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-306-41-007101

116-87-306-41-007101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
116-87-306-41-007101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
04-0518-10T

04-0518-10T

CONN SOCKET SIP 4POS GOLD

Aries Electronics

0 -
04-0518-10T

数据表

518 Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
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