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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 厂商型号 可用性 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
116-87-304-41-004101

116-87-304-41-004101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

0 -
116-87-304-41-004101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
114-87-312-41-117101

114-87-312-41-117101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

0 -
114-87-312-41-117101

数据表

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
114-87-312-41-134161

114-87-312-41-134161

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

0 -
114-87-312-41-134161

数据表

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
AW 127-33/Z-T

AW 127-33/Z-T

SOCKET 34 CONTACTS SINGLE ROW

Assmann WSW Components

0 -
AW 127-33/Z-T

数据表

- - Active - - - - - - - - - - - - - - -
116-87-306-41-008101

116-87-306-41-008101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
116-87-306-41-008101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
146-87-306-41-035101

146-87-306-41-035101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
146-87-306-41-035101

数据表

146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
146-87-306-41-036101

146-87-306-41-036101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
146-87-306-41-036101

数据表

146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-83-308-41-005101

110-83-308-41-005101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

0 -
110-83-308-41-005101

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-83-308-41-605101

110-83-308-41-605101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

0 -
110-83-308-41-605101

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-306-41-006101

116-83-306-41-006101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
116-83-306-41-006101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-87-314-10-001101

110-87-314-10-001101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

0 -
110-87-314-10-001101

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
A-CCS20-G

A-CCS20-G

CONN SOCKET PLCC 20POS GOLD

Assmann WSW Components

0 -
A-CCS20-G

数据表

- Tube Obsolete PLCC 20 (4 x 5) 0.050" (1.27mm) Gold - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
110-83-306-41-105161

110-83-306-41-105161

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
110-83-306-41-105161

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-83-306-31-012101

614-83-306-31-012101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
614-83-306-31-012101

数据表

614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
115-83-308-41-003101

115-83-308-41-003101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

0 -
115-83-308-41-003101

数据表

115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-87-210-41-105101

110-87-210-41-105101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
110-87-210-41-105101

数据表

110 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-87-310-41-001101

614-87-310-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
614-87-310-41-001101

数据表

614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
AW 127-31/Z-T

AW 127-31/Z-T

SOCKET 31 CONTACTS SINGLE ROW

Assmann WSW Components

0 -
AW 127-31/Z-T

数据表

- - Active - - - - - - - - - - - - - - -
A-CCS84-Z-SM

A-CCS84-Z-SM

CONN SOCKET PLCC 84POS TIN

Assmann WSW Components

0 -
A-CCS84-Z-SM

数据表

- Bag Obsolete PLCC 84 (4 x 21) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
HLS-0301-TT-12

HLS-0301-TT-12

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0301-TT-12

数据表

HLS Tube Active SIP 3 (3 x 1) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
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