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Power Integrations CAP200DG-TL

Name: CAP200DG-TL
Brand: Power Integrations
SKU: CAP200DG-TL
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

型号对比

零件编号:: CAP200DG-TL

制造商:: Power Integrations

分类:: 专用集成电路（IC）

封装:: 8-SOIC (0.154", 3.90mm Width)

数据表:: CAP200DG-TL.pdf

描述:: IC AUTOMATIC DISCHARGE 8-SO

数量:: 请求报价加入RFQ列表立即购买加入购物车

单价:￥0.400000

总价:￥0.400000

付款:

运费:

库存:9,847

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库存:9,847

数量	单价	总价
1+	￥0.400000	￥0.400000
100+	￥0.329000	￥32.900000
1000+	￥0.280000	￥280.000000

请求报价加入购物车

产品详情

CAP200DG-TL (CAPZero-2) – Zero-Loss Automatic X-Capacitor Discharge IC

CAP200DG-TL is a two-terminal, self-supplied IC that blocks current through X-capacitor discharge resistors while AC is present, and automatically discharges the X capacitor when AC is removed-helping designers achieve ultra-low standby power without sacrificing EMI performance.

Breakdown1000 V

X-Cap Range100 nF – 6 mF

PackageSO-8 (D)

Tape & ReelTL, 2.5k pcs

Engineering note: Parameter values and behaviors should be verified against the official datasheet and your final surge / safety tests.

Product Positioning

CAP200DG-TL is positioned for AC-DC converters and appliances that must meet strict standby consumption limits while still using sufficiently large X capacitors for differential-mode EMI filtering. By "disconnecting" the discharge resistor path during normal AC operation, it enables designers to use larger X capacitors (and potentially smaller inductors) without increasing no-load power.

When AC is connected: blocks current through discharge resistors → near-zero dissipation.
When AC is removed: reconnects resistors → safely discharges the X capacitor automatically.

Technical Introduction

Traditional X-capacitor discharge resistors continuously dissipate power whenever AC is applied. CAP200DG-TL changes that: it blocks resistor current while AC is present, reducing standby loss to a level that is effectively negligible in typical compliance measurements, and then automatically discharges the capacitor once AC is disconnected.

Practical outcome: you can tune EMI performance (often by increasing X-capacitance) without paying for it in standby power.

Product Advantages

Near-Zero Standby Loss

Blocks discharge resistor current when AC is present, targeting ultra-low standby power in offline designs.

Wide X-Cap Coverage

One part supports X-capacitor values from small (100 nF) to very large (mF range), allowing broad EMI tuning.

Two-Terminal Simplicity

Only two terminals (D1/D2). Can be used before or after the input fuse, simplifying safety placement decisions.

Rugged Surge Performance

High differential surge withstand with internal 1000 V MOSFETs and high common-mode surge immunity without an external ground.

Feature Summary

Self-Supplied Operation

No external bias supply required, reducing BOM and design complexity.

>4 mm Creepage

Package + PCB approach supports creepage/clearance goals and placement in high-voltage input sections.

Flexible EMI Filter Design

Enables larger X capacitors (improved DM EMI performance) without increasing no-load consumption.

Optional Surge Attenuation (CEXT)

For demanding surge tests, an optional small HV capacitor between D1/D2 can reduce peak drain voltage.

Package & Footprint Guide

CAP200DG-TL uses an SO-8 (D) package. The pin configuration is designed so the package width supports creepage/clearance of over 4 mm when implemented correctly on the PCB.

Package drawing placeholder
(Use your site image / PDF snapshot)

Layout Notes

D1: Pins 2 & 3 (recommended to couple pins 1-4 together on PCB).
D2: Pins 6 & 7 (recommended to couple pins 5-8 together on PCB).
Keep creepage/clearance around the HV nodes; follow your safety standard and PCB rules.

Pin Functions (SO-8 D)

High-voltage terminal (paired pins). Used with external resistor network and X-capacitor connection.

High-voltage terminal (paired pins). Works with D1 to block / discharge the X capacitor path.

No-connect pins. Typically tied (coupled) to help creepage/spacing robustness per layout guidance.

PCB Coupling

Recommended: couple pins 1-4 together and pins 5-8 together on the PCB for best creepage/clearance usage.

Key Specifications

Breakdown Voltage (BVDSS)	1000 V
Total X Capacitance Supported	100 nF to 6 mF
Total Series Resistance (R1 + R2)	7.5 MΩ to 142 kΩ (nominal range; select per X-cap value and discharge time target)
Discharge Behavior	Automatic discharge through external resistors when AC is disconnected (RC time constant designed to be < 1 s nominal)
Peak Drain Current (rating note)	5.333 mA peak (rating conditions apply)
Operating Ambient	-10 °C to +105 °C
Package	SO-8 (D)

Design Reminder: In surge validation, measure the peak voltage across D1–D2 in the final system and allow margin below device breakdown. For high peak voltage cases, a small HV capacitor (CEXT) between D1 and D2 may be used as an attenuation option.

Manufacturer Introduction

Power Integrations is known for power-conversion ICs and energy-efficient offline solutions. The CAPZero family targets standby-power reduction and compliance-oriented designs by addressing "always-on" losses in safety discharge networks.

For production designs, always validate safety, surge, and EMI performance using the latest official documentation and your compliance lab test results.

Applications

AC-DC Adapters & Chargers

Ultra-low no-load consumption designs where standby limits are strict and EMI filtering must remain robust.

Home Appliances

Systems requiring compliance-driven standby reduction while maintaining safety discharge behavior of X capacitors.

Low-Standby Offline Power Supplies

Any converter platform targeting very low standby power, especially when X-cap value needs to be increased for EMI reasons.

EMI Filter Optimization

Designs using larger X capacitors to reduce differential-mode noise and potentially shrink inductive components.

Quality & Reliability Notes

Surge & Safety Validation

Validate D1–D2 peak voltage during surge tests in the final system. Keep engineering margin below breakdown and confirm probe isolation practices.

Resistor Fault Planning

Select R1/R2 with adequate voltage and power ratings for single-fault conditions (e.g., D1–D2 short), and consider splitting resistors to distribute dissipation.

Creepage / Clearance Discipline

Use recommended pin coupling and layout spacing. Keep HV nodes away from low-voltage nets and sensitive sensing traces.

Components Placement

MOV and optional CEXT placement significantly affects surge stress. Follow the proven placement approach from the reference circuits and confirm with testing.

Equivalent & Alternatives

CAP200DG-TL is a packaging option (Tape & Reel) of the CAP200DG device family. In many BOMs, the closest "equivalent" is the same electrical part with a different packing suffix.

Direct equivalent: CAP200DG (same device, different packing option depending on supplier listing).
Functional alternative (discrete): traditional bleeder resistors across X capacitor (simple but increases standby loss).
Functional alternative (active): HV switch + control network to disconnect/enable discharge path (higher BOM and validation effort).

Selection Tip: When choosing a substitute, confirm: (1) surge stress across the device, (2) discharge time compliance, (3) creepage/clearance and safety approvals, and (4) standby power target in your measurement method.

FAQ

How does CAP200DG-TL reduce standby power compared with normal discharge resistors?

In a conventional design, discharge resistors continuously draw current whenever AC is present. CAP200DG-TL blocks that current path during normal AC operation, so the discharge network does not create continuous loss. When AC is removed, it reconnects the resistors to discharge the X capacitor automatically.

Where should the MOV be placed for best surge performance?

MOV placement strongly impacts peak stress across the device. A placement directly across the X capacitor typically offers better protection. In final designs, measure the peak voltage across D1–D2 during surge tests to confirm sufficient margin.

What is CEXT and when should I consider adding it?

CEXT is an optional small HV ceramic capacitor connected between D1 and D2 to attenuate peak surge voltage across the device. It can help if measured peaks approach the margin limit. Note that adding CEXT may slightly increase power due to charge/discharge currents through R1/R2.

Can I split R1 and R2 into multiple resistors?

Yes. Splitting the total resistance into multiple series parts can help distribute dissipation and reduce voltage per resistor under fault tests. Keep the total resistance in line with the recommended range for your X-cap value and discharge requirement.

Is CAP200DG-TL suitable for low AC input rails like 18 VAC / 24 VAC?

The discharge behavior continues down to low voltages as the X capacitor is discharged after AC removal. Validate your specific safety and discharge criteria for the target rail.

Summary

CAP200DG-TL is a practical choice when you need automatic X-capacitor discharge but want to avoid the standby power penalty of traditional discharge resistors. With a 1000 V rating, two-terminal simplicity, and wide X-cap compatibility, it helps engineers optimize EMI filters while keeping no-load consumption low.

Implementation checklist: confirm R1/R2 ratings and values, verify MOV placement, measure D1–D2 peak voltage under surge, and validate discharge time in the final system.

CAP200DG-TL 规格

规格
常见问题
产品文章

型号对比
相关分类

图片
零件编号	CAP200DG-TL	CAP200DG
制造商	Power Integrations	Power Integrations
系列	CAPZero™	CAPZero™
封装/外壳	8-SOIC (0.154", 3.90mm Width)	8-SOIC (0.154", 3.90mm Width)
包装	Tape & Reel (TR)	Tube
产品状态	Active	Discontinued at Digi-Key
可编程	Not Verified	Not Verified
类型	Automatic Discharge	Automatic Discharge
应用	Converter, ACDC	Converter, ACDC
安装类型	Surface Mount	Surface Mount
供应商设备封装	8-SO	8-SO
等级	-	-
认证	-	-

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