电源管理 - 专用

电源管理 - 专用

专用电源管理 IC 是面向特定系统,特定负载或特定应用场景设计的电源管理芯片,常用于处理器供电,系统电源控制,负载管理,电源排序,电源保护,电池供电设备,通信模块,汽车电子,工业控制和嵌入式系统等电路中.该类器件可根据应用需求实现稳压控制,电压监控,电流限制,故障保护,低功耗管理和多通道供电管理等功能.

宝利科技作为专业电子元器件分销商,可为客户供应行业主流厂商的多系列专用电源管理 IC 产品,包括德州仪器(Texas Instruments),亚德诺(Analog Devices),意法半导体(STMicroelectronics),安森美(onsemi),英飞凌(Infineon),微芯科技(Microchip),瑞萨(Renesas),恩智浦(NXP),芯源系统(MPS),美信(Maxim Integrated)等品牌.您可在下方产品列表中查询所需专用电源管理芯片型号的库存,价格,封装规格,品牌,参数及 PDF 规格书等相关资料,并提交 BOM 或型号清单进行批量询价.

制造商 系列 封装/外壳 包装 产品状态 应用 电流 - 电源 电压 - 电源 工作温度 等级 认证 安装类型 供应商设备封装

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图片 厂商型号 可用性 价格 数量 数据表 系列 封装/外壳 包装 产品状态 应用 电流 - 电源 电压 - 电源 工作温度 等级 认证 安装类型 供应商设备封装
MC33VR5500V3ESR2

MC33VR5500V3ESR2

VR5500

NXP USA Inc.

0 -

-

* - Tape & Reel (TR) Active - - - - - - - -
MC33VR5500V2ESR2

MC33VR5500V2ESR2

VR5500

NXP USA Inc.

0 -

-

* - Tape & Reel (TR) Active - - - - - - - -
MC33VR5500V1ESR2

MC33VR5500V1ESR2

VR5500

NXP USA Inc.

0 -
MC33VR5500V1ESR2

数据表

* - Tape & Reel (TR) Active - - - - - - - -
MC33VR5500V0ESR2

MC33VR5500V0ESR2

VR5500

NXP USA Inc.

0 -
MC33VR5500V0ESR2

数据表

* - Tape & Reel (TR) Active - - - - - - - -
UC29432DTRG4

UC29432DTRG4

IC ANLG CTRLR ADJ 8SOIC

Texas Instruments

0 -
UC29432DTRG4

数据表

- 8-SOIC (0.154", 3.90mm Width) Tape & Reel (TR) Discontinued at Digi-Key Overvoltage Comparator, Optocoupler 500µA 2.2V ~ 24V -25°C ~ 85°C - - Surface Mount 8-SOIC
MC35FS6506NAE

MC35FS6506NAE

SYSTEM BASIS CHIP, DCDC 0.8A VCO

NXP USA Inc.

0 -
MC35FS6506NAE

数据表

- 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC35FS4501NAE

MC35FS4501NAE

FS4500

NXP USA Inc.

0 -
MC35FS4501NAE

数据表

- 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
LTC3331IUH#TRPBF

LTC3331IUH#TRPBF

IC REG BUCK/LDO SYNC 50MA 32QFN

Analog Devices Inc.

0 -
LTC3331IUH#TRPBF

数据表

- 32-WFQFN Exposed Pad Tape & Reel (TR) Active Energy Harvesting 950nA 1.8V ~ 5.5V, 3V ~ 19V -40°C ~ 125°C - - Surface Mount 32-QFN (5x5)
MVR5510AVMA6EPR2

MVR5510AVMA6EPR2

IC PMIC VR5510 QM

NXP USA Inc.

0 -

-

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active - 15mA 2.7V ~ 60V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 56-HVQFN (8x8)
MVR5510AVMA0EPR2

MVR5510AVMA0EPR2

IC PMIC VR5510 QM

NXP USA Inc.

0 -

-

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active - 15mA 2.7V ~ 60V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 56-HVQFN (8x8)
MVR5510AVMA4EPR2

MVR5510AVMA4EPR2

IC PMIC VR5510 QM

NXP USA Inc.

0 -

-

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active - 15mA 2.7V ~ 60V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 56-HVQFN (8x8)
MVR5510AVMAHEPR2

MVR5510AVMAHEPR2

IC PMIC VR5510 QM

NXP USA Inc.

0 -

-

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active - 15mA 2.7V ~ 60V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8100CCESR2

MC33PF8100CCESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0 -
MC33PF8100CCESR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8100EPESR2

MC33PF8100EPESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0 -
MC33PF8100EPESR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8100CFESR2

MC33PF8100CFESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0 -
MC33PF8100CFESR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8100EQESR2

MC33PF8100EQESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0 -
MC33PF8100EQESR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8100EAESR2

MC33PF8100EAESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0 -
MC33PF8100EAESR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8100ERESR2

MC33PF8100ERESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0 -
MC33PF8100ERESR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8100CHESR2

MC33PF8100CHESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

0 -
MC33PF8100CHESR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33PF8100A0ESR2

MC33PF8100A0ESR2

POWER MANAGEMENT IC I.MX8 NON-PR

NXP USA Inc.

0 -
MC33PF8100A0ESR2

数据表

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
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